產品名稱：Cho-Bond® Two-Part Conductive Adhesive Cho-Bond®雙組分導電膠

PRODUCT DETAILS

Trade Name :  Cho-Bond®

Item Name :  Conductive Adhesive

Short Desc :  50-02-0584-0029 CHOBOND 2.5-GM PKG

Packaging :  200/Carton

UNSPSC :  31201600

The fine silver filler of Cho-Bond 584-29 make it a good material choice for precise application in and around tight spaces and electrical components. Cho-Bond 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues.

產品詳情

商品名：Cho-Bond®

商品名稱：導電膠

簡短說明：50-02-0584-0029 CHOBOND 2.5-GM PKG

包裝：200 /箱

UNSPSC：31201600

Cho-Bond 584-29的精細銀填料使其成為在狹小空間和電氣元件中及其周圍應用的理想材料選擇。Cho-Bond 584-29有各種尺寸和包裝，因此客戶可以選擇適合其應用的包裝和材料尺寸，大限度地減少材料廢料和混合問題。

SPECS

眼鏡

FEATURES & APPLICATIONS

Features :

• Fast heat cure, increases throughput and minimizes equipment downtime
• Silver filler
• Excellent conductivity 0.002 ohm-cm
• 30 min working life, works well over wide temperature range, good chemical resistance, >1200 psi lap shear, good for permanently bonding surfaces
• Multiple packaging options
• No weighing required, mix and dispense in same package, minimizes process scrap
• Thin paste
• May be dispensed out of very small needles, fill small cracks and voids
• Low VOC content
• Minimal shrinkage

功能和應用

• 特點：
• 快速熱固化，提高產量並大限度地減少設備停機時間
• 銀填料
• 優異的導電率0.002 ohm-cm
• 工作壽命30分鐘，適用於寬溫度範圍，良好的耐化學性，> 1200 psi的搭接剪切，適用於長久粘接表麵
• 多種包裝選擇
• 無需稱量，在同一包裝中混合和分配，大限度地減少工藝廢料
• 薄膏
• 可以用非常小的針頭分配，填充小裂縫和空隙
• 低VOC含量
• 收縮率小