BGA Pad Circuit Frame CBGA焊盤電路框架 CS020025AT 峰源隆國際貿易（上海）有限公司

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產品名稱：BGA Pad Circuit Frame CBGA焊盤電路框架
產品型號：CS020025AT
產品廠商：美國EIS
產品文檔：

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簡單介紹：

Medic CS020025AT is a circuit frame BGA pad with tin and lead plating and is not RoHS compliant. Additionally, CIR CS015020AT allows users to replace damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a Medic CS020025AT是一種電路框架BGA焊盤，鍍錫和鉛鍍層，不符合RoHS標準。此外，CIR CS015020AT允許用戶在幾分鐘內更換損壞的表麵貼裝焊盤，焊盤和導體，而無需液體環氧樹脂，粘接強度等於原始粘接強度

詳情介紹：

PRODUCT DETAILS

Item Name : Circuit Frame

Short Desc : CIRCUIT FRAME, BGA PADS, .020/.025

UNSPSC : 23271700

This item features dry-film adhesive backing which make this circuit board repair procedure easy, fast and highly reliable. This is a reliable IPC recommended procedure which meets the highest conformance level for this type of repair.

產品詳情

商品名稱：電路框架

簡短描述：CIRCUIT FRAME，BGA PADS，.020 / .025

UNSPSC：23271700

該產品采用乾膜背膠，使電路板修複過程簡單，快速，高度可靠。這是一種可靠的IPC推薦程序，可滿足此類維修的高一致性要求。

SPECS

Design & Construction

Finish	Tin/Lead
Material	Rolled Annealed Copper Foil Base, B-Staged Modified Acrylic Film Adhesive Backing

General Features

Shelf Life	12 Months
Type	BGA Pad

Physical Properties

Dimensions

2.25 Inch L x 1.5 Inch W Frame

眼鏡

設計與施工

完	錫/鉛
材料	軋製退火銅箔基，B級改性丙烯酸薄膜粘合劑背襯

一般特征

保質期	12個月
類型	BGA墊

物理特性

外形尺寸	2.25英寸L x 1.5英寸W框架

FEATURES & APPLICATIONS

Features :

Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes
Circuit frames with dry film adhesive backing make this delicate repair procedure easy, fast and highly reliable
This reliable IPC recommended procedure meets the highest conformance level for this type of repair
For over 30 years circuit frames have been used by thousands of commercial, medical and military manufacturers around the globe
0.02 Inch x 0.025 Inch pad size