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  • 產品名稱：Soder-Wick® 50 Rosin Activated Desoldering Braid Soder-Wick®50鬆香活性脫毛編織物

  • 產品型號：50-1-25
  • 產品廠商：美國EIS
  • 產品文檔：
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簡單介紹：
Soder-Wick 50 offers the state of the art in desoldering technology. Soder-Wick is designed for today's heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick 50提供了脫焊技術的新技術。Soder-Wick專為當今的熱敏電子元件而設計，采用質量輕，純銅編織結構，即使在低溫下也能提供更好的導熱性。
詳情介紹：

PRODUCT DETAILS


Trade Name :  Soder-Wick®

Series :  50

Item Name :  Desoldering Braid

UNSPSC :  23271803

Soder-Wick 50 responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. A full range of sizes and flux types are available, including Rosin, no-clean, unfluxed and a high temperature Lead-Free version.


產品詳情


商品名稱：Soder-Wick®

係列：50

商品名稱：脫焊辮子

UNSPSC：23271803

Soder-Wick 50比傳統的拆焊辮子響應更快，從而大限度地減少過熱並防止PCB損壞。提供各種尺寸和助焊劑類型，包括鬆香，免清洗，不褪色和高溫無鉛版本。



SPECS



Design & Construction
Flux Type Rosin Activated 
Material Copper 
Spool Type Bobbin 
General Features
Shelf Life 24 Months 


眼鏡



設計與施工
助焊劑類型 鬆香活化 
材料 銅 
線軸類型 筒管 
一般特征
保質期 24個月 




FEATURES & APPLICATIONS


Features :



  • Minimizes the risk of damage associated with static electricity
  • Non-corrosive ultra high purity type R rosin flux
  • Will not leave ionic contamination on the boards
  • Optimized construction for faster wicking and heat transfer
  • Halide free


Applications :



  • For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script



功能和應用


特點：



  • 大限度地降低與靜電相關的損壞風險
  • 非腐蝕性*高純型R鬆香助焊劑
  • 不會在板上留下離子汙染
  • 優化的結構，可加快芯吸和傳熱
  • 無鹵化物


應用：



  • 用於通孔元件，表麵貼裝器件焊盤，BGA焊盤，微電路，端子，接線片和接杆以及識彆腳本



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