產品詳情
  • 產品名稱:Surface Mount Pad Circuit Frame 表麵貼裝電路框架

  • 產品型號:CS012060AT
  • 產品廠商:美國EIS
  • 產品文檔:
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簡單介紹:
Medic CS012060AT is a circuit frame surface mount pad with tin and lead plating and is not RoHS compliant. This item features dry-film adhesive backing which make this circuit board repair procedure easy, fast and highly reliable. This is a reliable IPC recommended procedure which meets the Medic CS012060AT是一種電路框架表麵貼裝焊盤,鍍錫和鉛鍍層,不符合RoHS標準。該產品采用乾膜背膠,使電路板修複過程簡單,快速,高度可靠。這是一種可靠的IPC**程序,可滿足此類維修的高一致性要求
詳情介紹:

PRODUCT DETAILS


Item Name :  Circuit Frame

Short Desc :  CIRCUIT FRAME, SMP, SET/3

Packaging :  3 Set/Pack

UNSPSC :  23271700

Additionally, CIR CS012060AT allows users to replace damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes.


產品詳情


商品名稱:電路框架

簡短描述:CIRCUIT FRAME,SMP,SET / 3

包裝:3件套/包裝

UNSPSC:23271700

此外,CIR CS012060AT允許用戶在幾分鐘內更換損壞的表麵貼裝焊盤,焊盤和導體,而無需液體環氧樹脂,粘接強度等於原始粘接強度。



SPECS



Design & Construction
Finish Tin/Lead 
Material Rolled Annealed Copper Foil Base, B-Staged Modified Acrylic Film Adhesive Backing 
General Features
Shelf Life 12 Months 
Type Surface Mount Pad 
Physical Properties
Dimensions 2.25 Inch L x 1.5 Inch W Frame 


眼鏡



設計與施工
錫/鉛 
材料 軋製退火銅箔基,B級改性丙烯酸薄膜粘合劑背襯 
一般特征
保質期 12個月 
類型 表麵貼裝墊 
物理特性
外形尺寸 2.25英寸L x 1.5英寸W框架 




FEATURES & APPLICATIONS


Features :



  • Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes
  • Circuit frames with dry film adhesive backing make this delicate repair procedure easy, fast and highly reliable
  • This reliable IPC recommended procedure meets the highest conformance level for this type of repair
  • For over 30 years circuit frames have been used by thousands of commercial, medical and military manufacturers around the globe
  • 0.012 Inch x 0.06 Inch pad size



功能和應用


特點:



  • 想象一下,隻需幾分鐘就可以更換損壞的表麵貼裝焊盤,焊盤和導體,而無需使用液體環氧樹脂,粘接強度等於原始粘接強度
  • 采用乾膜背膠的電路框架使這種精細的修複過程變得簡單,快速和高度可靠
  • 這種可靠的IPC**程序滿足此類維修的高一致性水平
  • 30多年來,**數千家商業,醫療和**製造商使用了電路框架
  • 0.012英寸x 0.06英寸焊盤尺寸



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