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NU-CHEK
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PRODUCT DETAILS
Trade Name : Soder-Wick®
Series : 40
Item Name : Desoldering Braid
UNSPSC : 23271803
Soder-Wicklead-free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components.
產品詳情
商品名稱:Soder-Wick®
係列:40
商品名稱:脫焊辮子
簡短描述:DESOLDERING-BRAID,.035“WIDE 5'YEL
包裝:25 SD梭芯/外殼
UPC:032599098847
UNSPSC:23271803
Soder-Wicklead的響應速度比任何其他傳統的拆焊辮子都要快。這種獨特的設計可大限度地減少過熱,並且需要較少的“接觸”時間,從而防止對PCB和敏感元件造成熱損壞。
SPECS
Flux Type | No-Clean |
Material | Copper |
Shelf Life | 24 Months |
Type | Lead Free |
眼鏡
顏色 | 黃色 |
助焊劑類型 | 免洗 |
材料 | 銅 |
保質期 | 24個月 |
類型 | 無鉛 |
長度 | 5英尺 |
寬度 | 0.03英寸 |
FEATURES & APPLICATIONS
Features :
- Engineered specifically for high temperature, lead-free solders
- Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
- Specifically designed for all lead-free solders
- Can also be used with tin/lead solders
- Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
- Minimizes the risk of damage associated with static electricity
- Non-corrosive ultra high purity no-clean flux
- Will not leave ionic contamination on the boards
- Especially effective at removing residual solder from SMT pads
- Fastest wicking and heat transfer
- High capacity for solder uptake
- Halide-free, no-corrosive residues
- Minimizes risk of heat damage to pads, components and PCB
Applications :
- For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script
功能和應用
特點:
- 專為高溫無鉛焊料而設計
- 與傳統的拆焊辮子相比,可以更快速,更有效地將熱量傳遞到焊點
- 專為所有無鉛焊料而設計
- 也可與錫/鉛焊料一起使用
- Soder-Wick無鉛封裝在ESD**靜電耗散線軸中
- 大限度地降低與靜電相關的損壞風險
- 無腐蝕性*高純度免清洗助焊劑
- 不會在板上留下離子汙染
- 特彆有效地去除SMT焊盤中的殘留焊料
- 快的吸濕排汗和熱轉印
- 高吸收焊料容量
- 不含鹵化物,無腐蝕性的殘留物
- 大限度地降低焊盤,元件和PCB的熱損壞風險
- 專為高溫無鉛焊料而設計
- 與傳統的拆焊辮子相比,可以更快速,更有效地將熱量傳遞到焊點
- 專為所有無鉛焊料而設計
- 也可與錫/鉛焊料一起使用
- Soder-Wick無鉛封裝在ESD**靜電耗散線軸中
- 大限度地降低與靜電相關的損壞風險
- 無腐蝕性*高純度免清洗助焊劑
- 不會在板上留下離子汙染
- 特彆有效地去除SMT焊盤中的殘留焊料
- 快的吸濕排汗和熱轉印
- 高吸收焊料容量
- 不含鹵化物,無腐蝕性的殘留物
- 大限度地降低焊盤,元件和PCB的熱損壞風險
- 編織尺寸為#1
應用:
- 用於通孔元件,表麵貼裝器件焊盤,BGA焊盤,微電路,端子,接線片和接杆以及識彆腳本