產品詳情
  • 產品名稱:40 Soder-Wick® No-Clean Desoldering Braid 40 Soder-Wick®免清洗脫焊編織物

  • 產品型號:40-1-5
  • 產品廠商:美國EIS
  • 產品文檔:
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簡單介紹:
Soder-Wick lead-free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead-free solders. The single layer weave used for Soder-Wick lead free braid is lighter in mass than any other desoldering braid available and allows for lead-fr Soder-Wick無鉛是脫焊技術的新技術。它專為去除當今的高溫無鉛焊料而設計。用於Soder-Wick無鉛編織層的單層編織物質比任何其他可用的脫焊編織物質量更輕,並且允許在較低溫度下去除無鉛焊料
詳情介紹:

PRODUCT DETAILS


Trade Name :  Soder-Wick®

Series :  40

Item Name :  Desoldering Braid

UNSPSC :  23271803

Soder-Wicklead-free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components.


產品詳情


商品名稱:Soder-Wick®

係列:40

商品名稱:脫焊辮子

簡短描述:DESOLDERING-BRAID,.035“WIDE 5'YEL

包裝:25 SD梭芯/外殼

UPC:032599098847

UNSPSC:23271803

Soder-Wicklead的響應速度比任何其他傳統的拆焊辮子都要快。這種獨特的設計可大限度地減少過熱,並且需要較少的“接觸”時間,從而防止對PCB和敏感元件造成熱損壞。



SPECS



Design & Construction
Flux Type No-Clean 
Material Copper 
General Features
Shelf Life 24 Months 
Type Lead Free 


眼鏡



設計與施工
顏色 黃色 
助焊劑類型 免洗 
材料 銅 
一般特征
保質期 24個月 
類型 無鉛 
物理特性
長度 5英尺
寬度 0.03英寸




FEATURES & APPLICATIONS


Features :



  • Engineered specifically for high temperature, lead-free solders
  • Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
  • Specifically designed for all lead-free solders
  • Can also be used with tin/lead solders
  • Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
  • Minimizes the risk of damage associated with static electricity
  • Non-corrosive ultra high purity no-clean flux
  • Will not leave ionic contamination on the boards
  • Especially effective at removing residual solder from SMT pads
  • Fastest wicking and heat transfer
  • High capacity for solder uptake
  • Halide-free, no-corrosive residues
  • Minimizes risk of heat damage to pads, components and PCB


Applications :



  • For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script



功能和應用


特點:



  • 專為高溫無鉛焊料而設計
  • 與傳統的拆焊辮子相比,可以更快速,更有效地將熱量傳遞到焊點
  • 專為所有無鉛焊料而設計
  • 也可與錫/鉛焊料一起使用
  • Soder-Wick無鉛封裝在ESD**靜電耗散線軸中
  • 大限度地降低與靜電相關的損壞風險
  • 無腐蝕性*高純度免清洗助焊劑
  • 不會在板上留下離子汙染
  • 特彆有效地去除SMT焊盤中的殘留焊料
  • 快的吸濕排汗和熱轉印
  • 高吸收焊料容量
  • 不含鹵化物,無腐蝕性的殘留物
  • 大限度地降低焊盤,元件和PCB的熱損壞風險
  • 專為高溫無鉛焊料而設計
  • 與傳統的拆焊辮子相比,可以更快速,更有效地將熱量傳遞到焊點
  • 專為所有無鉛焊料而設計
  • 也可與錫/鉛焊料一起使用
  • Soder-Wick無鉛封裝在ESD**靜電耗散線軸中
  • 大限度地降低與靜電相關的損壞風險
  • 無腐蝕性*高純度免清洗助焊劑
  • 不會在板上留下離子汙染
  • 特彆有效地去除SMT焊盤中的殘留焊料
  • 快的吸濕排汗和熱轉印
  • 高吸收焊料容量
  • 不含鹵化物,無腐蝕性的殘留物
  • 大限度地降低焊盤,元件和PCB的熱損壞風險
  • 編織尺寸為#1


應用:



  • 用於通孔元件,表麵貼裝器件焊盤,BGA焊盤,微電路,端子,接線片和接杆以及識彆腳本



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