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  • 產品名稱：EPO-TEK H70E Thermally Conductive Epoxy 環氧樹脂膠粘劑

  • 產品型號：16017
  • 產品廠商：其它品牌
  • 產品文檔：
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簡單介紹：
EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adh
詳情介紹：

EPO-TEK® H70E Thermally Conductive Epoxy

環氧樹脂膠粘劑

環氧樹脂粘合劑

環氧樹脂膠（**膠）

導熱絕緣環氧樹脂膠粘劑

環氧膠粘劑（大力膠）

EPO-TEK® H70E是一種雙組份、導熱絕緣的環氧樹脂，設計來滿足微電子和光電子芯片的粘接應用。它是非常優良的散熱粘合劑，尤其**使用在需要良好散熱的應用上。它具有優異的操作性能，在室溫下擁有*長的粘附壽命。使用非常簡便；可以絲網印製，機器分配和印花或者手工實施。擁有優良的粘附力，可以粘附於鐵或者非鐵類金屬、玻璃、陶瓷、可伐合金以及印刷電路板。凝固非常迅速。


EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly.

Cure Schedule (minimum bond temperature/time)
175ºC……..1 Minute
150ºC……..5 Minutes
120ºC… ..15 Minutes
80ºC… ..90 Minutes

Properties (summary)

  • Color : Grey / Beige
  • Consistency: Slightly Pourable Paste
  • Viscosity: 4,000 – 7,000 cps
  • Thermal Conductivity: 0.9 W/mK
  • Operating Temperature: -55ºC to 200ºC (-67ºF to 392ºF)
  • Pot Life
    Prod # Description Unit
    16017
    		EPO-TEK® H70E Epoxy, 85g (3 oz.)
    each

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