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  • 產品名稱：M-Bond 610

  • 產品型號：16039
  • 產品廠商：其它品牌
  • 產品文檔：
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簡單介紹：
M-BOND™ 610 Adhesive ion milling, cross-sectioning 這是一個不導電的雙組分的溶劑稀釋劑，環氧酚醛類粘合劑可以用於高性能的研究。耐化學性的，並提供一薄層膠，它具有良好的離子銑性能。
詳情介紹：

M-BOND™ 610 Adhesive

ion milling, cross-sectioning

This is a non-conductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.
Operating temperature range, short term is -269° to +370°C; long term, -269° to +260°C.
Elongation can occur at +24°C (3%). This may be the widest temperature range general-purpose adhesive that is available.
A kit contains: 4 bottles (14g each) Resin, 4 bottles (11g each) Curing Agent, 4 brush caps for dispensing mixed adhesives, 4 disposable mixing funnels and instructions.

這是一種非導電雙組分溶劑稀釋環氧酚醛膠粘劑，適用於高性能應用。 耐化學腐蝕，並提供一層具有良好離子銑削性能的膠水。 它粘度低，*薄，具有*小的蠕變，滯後和線性問題。 固體含量為22％。 這是一種優異的粘合劑，用於安裝用於TEM成像或FIB的TEM凹坑和樣品粘合到TEM網格的樣品。
Prod # Description Unit
16039
M-Bond™ 610, complete kit
each

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