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產品詳情
簡單介紹:
Low Temperature SMD and through hole removal and BGA pad re-dressing solder. 低溫SMD和通孔去除和BGA焊盤重新修整焊料。
詳情介紹:
- Brand name : Zephyrtronics
- Trade Name : LOWMELT®
- Item Name : Desolder Wire
- Short Desc : LOWMELT DE-SOLDER WIRE 32 FT
- UNSPSC : 23271800
LowMelt allows rapid SMD and Thru-Hole removal through the decades-old process of solder Co-Metallization with either a just pre-heater placed below the PCB or with a simple soldering iron or with any heated desoldering tool or, yes, even under a hot air nozzle. Every lab and rework bench should have a tube of LowMelt at the technician's fingertips when needed. Our customers believe it's that essential.
品牌名稱:Zephyrtronics
商品名稱:LOWMELT®
商品名稱:Desolder Wire
簡短說明:LOWMELT DE-SOLDER WIRE 32 FT
UNSPSC:23271800
LowMelt通過幾十年曆史的焊接共金屬化工藝,可以快速去除SMD和通孔,隻需將預熱器放置在PCB下方或使用簡單的烙鐵或任何加熱的拆焊工具,或者即使在 熱風噴嘴。 每個實驗室和返工工作台在需要時都應該在技術人員的指尖處使用LowMelt管。 我們的客戶認為這是至關重要的。
Environmental Condition
Melting Range | 302 deg F |
Physical Properties
Alloy | Sn Pb |
熔化範圍302華氏度
物理特性
合金Sn Pb
Features :
- Prevents burning, warping PCB's in rework
- Prevents lifting pads during rework
- No need for nozzles to remove SMD's
- Remove through hole chips and connectors easier
- Prevents high temperature damage to IC's and caps
- Eliminates sticky desolder wick with BGA's
- De-clogs your desoldering tools quickly
- Redress weak BGA pads without wick/braid
- 32 ft length wire
防止在返工時燒毀,翹曲PCB
在返工期間防止提升墊
不需要噴嘴去除SMD
更容易移除通孔芯片和連接器
防止IC和電容器的高溫損壞
用BGA消除粘性脫焊劑燈芯
快速堵塞您的拆焊工具
在冇有燈芯/編織物的情況下修複弱BGA襯墊
32英尺長的電線
產品谘詢
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