產品名稱：R520A-SAC305-89.5 Type 3 Lead-Free Solder Paste R520A-SAC305-89.5 Type 3無鉛焊膏

PRODUCT DETAILS

Series :  R520A-SAC305-89.5

Item Name :  Lead-Free Solder Paste

UNSPSC :  23271816

R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards.

產品詳情

係列：R520A-SAC305-89.5

商品名稱：無鉛焊膏

UNSPSC：23271816

R520A的配方可以從模板中一致地釋放出那些具有抗坍落度特性和優選焊料沉積定義的臨界細間距應用（0.5 mm / 20 mils）。該配方中的活化劑包具有強的侵蝕性，可為OSP塗層和Immersion Gold提供潤濕性，而不是化學鍍鎳（ENIG）板。

SPECS

眼鏡

FEATURES & APPLICATIONS

Features :

• Stable tack life to long stencil life
• Consistent printing over a range of temperatures and humidities
• Excellent wetting onto Ag/Pd leaded components
• Lead-free and water soluble
• Print speed up to 150 mm/sec (6 Inch/sec)
• Reduces scrap due to less paste dry out
• Residues easily removed with hot DI water
• Metals percentage of 89.5%
• Temperature rating of 21 to 25 deg C

Applications :

• For Stencil Printing Applications

功能和應用

特點：

• 穩定的粘著壽命，延長模板壽命
• 在一係列溫度和濕度下保持一致的打印
• 對Ag / Pd含鉛組件具有潤濕性
• 無鉛和水溶性
• 打印速度高達150毫米/秒（6英寸/秒）
• 由於較少的糊狀物乾燥而減少了廢料
• 使用熱DI水輕易去除殘留物
• 金屬百分比為89.5％
• 溫度等級為21至25攝氏度

應用：

• 用於模板印刷應用