產品名稱：NXG1-SAC305-88.5 Type 3 Lead-Free Solder Paste NXG1-SAC305-88.5 Type 3無鉛焊膏

PRODUCT DETAILS

Series :  NXG1-SAC305-88.5

Item Name :  Lead-Free Solder Paste

UNSPSC :  23271816

NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.

產品詳情

係列：NXG1-SAC305-88.5

商品名稱：無鉛焊膏

UNSPSC：23271816

NXG1還在回流焊點中提供外觀，具有光滑，有光澤的焊料和淺色殘留物。該漿料還具有8個月內同類產品中長的保質期。NXG1符合ANSI / J-SDTD-005標準。根據IPC ANSI / J-STD-004B的通量被分類為ROL1。

SPECS

眼鏡

FEATURES & APPLICATIONS

Features :

• Capable of 120 min break times in printing
• Capable of print speeds up to 200 mm/sec (8 Inch/sec)
• Clean cosmetic aesthetics after reflow
• Excellent printing characteristics on 0.4 mm (16 Mil) pitch QFPs
• Excellent release from stencil
• Excellent wetting to a variety of metals
• Long stencil and tack life (process dependent)
• Longest shelf life at 8 months
• Low voiding behavior
• Reflowable in air and nitrogen
• Resistant to slump
• Contains halogen
• Metals percentage of 88.5%
• Melting range of 217 to 218 deg C
• Temperature rating of 21 to 25 deg C

Applications :

• For Stencil Printing Applications

功能和應用

特點：

• 印刷時間為120分鐘
• 打印速度可達200毫米/秒（8英寸/秒）
• 回流後清潔化妝品美觀
• 0.4毫米（16密耳）間距QFP具有印刷特性
• 模板的釋放
• 對各種金屬具有潤濕性
• 長模板和粘性壽命（取決於工藝）
• 長保質期為8個月
• 低排尿行為
• 可在空氣和氮氣中回流
• 抵抗衰退
• 含有鹵素
• 金屬百分比為88.5％
• 熔化範圍為217至218攝氏度
• 溫度等級為21至25攝氏度

應用：

• 用於模板印刷應用