EM828-SAC305-89.5 Lead-Free Solder Paste EM828-SAC305-89.5無鉛焊膏 SN96.5EM828-600GT4 峰源隆國際貿易（上海）有限公司

產品詳情

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產品名稱：EM828-SAC305-89.5 Lead-Free Solder Paste EM828-SAC305-89.5無鉛焊膏
產品型號：SN96.5EM828-600GT4
產品廠商：美國EIS
產品文檔：

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簡單介紹：

The EM828 is a lead-free, water soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products.

詳情介紹：

PRODUCT DETAILS

Series : EM828-SAC305-89.5

Item Name : Lead-Free Solder Paste

UNSPSC : 23271816

Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.

產品詳情

係列：EM828-SAC305-89.5

商品名稱：無鉛焊膏

UNSPSC：23271816

此外，無論打印速度，空閒時間和吞吐量如何，EM828在模板印刷過程中都非常穩定。EM828為各種電路板和元件表麵處理提供了大的潤濕性，從而簡化了向無鉛工藝的過渡。

SPECS

Design & Construction

Form	Paste
Applicable Materials	Stainless Steel, Molybdenum, Nickel Plated or Brass
Color	Silver Gray
Flux Type	Organic Activated or Water Soluble

General Features

Shelf Life	6 Months
Type	Lead-Free
Storage Temperature	0 to 10 deg C

Environmental Condition

Melting Range	217 deg C
Temperature Rating	21 deg C

Chemical Properties

Flux Formula	EM828
Mesh Size	-325/+500

Supporting Information

RoHS Info	2011/65/EU Directive
Flux Designator	ORH1

Physical Properties

Alloy	Sn96.5 Ag3.0 Cu0.5 (SAC305)
Odor/Scent	Mild

眼鏡

設計與施工

形成	糊
適用材料	不鏽鋼，鉬，鍍鎳或黃銅
顏色	銀灰
助焊劑類型	有機活性或水溶性

一般特征

保質期	6個月
類型	無鉛
貯存溫度	0到10攝氏度

環境條件

熔化範圍	217攝氏度
溫度等級	21攝氏度

化學性質

助焊劑配方	EM828
網格尺寸	-325 / + 500

支持信息

RoHS信息	2011/65 / EU指令
Flux指示器	ORH1

物理特性

合金	Sn96.5 Ag3.0 Cu0.5（SAC305）
氣味/香味	溫和

FEATURES & APPLICATIONS

Features :

Capable of breaks in printing of up to 60 min without any kneading
Contains halogen
Excellent wetting on a variety of metallizations
Long stencil and tack life (process dependent)
Low voiding underneath area array components
Print speed up to 150 mm/sec (6 Inch/sec)
Residues easily removed with hot DI water
Tremendous brick definition and slump resistance for reduction of bridging defects
Metals percentage of 89.5%
Melting range of 217 to 218 deg C
Temperature rating of 21 to 25 deg C