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  • 產品名稱：920-CXF No-Clean Soldering Flux 920-CXF免清洗焊劑

  • 產品型號：KES920CXFG
  • 產品廠商：美國EIS
  • 產品文檔：
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簡單介紹：
The 20-CXF is a zero halogen, low solids, no-clean organic flux designed for wave soldering conventional and surface mount circuit board assemblies. This flux eliminates defects often experienced in surface mount assembly wave soldering operations with trad 920-CXF是一種零鹵素，低固含量，免清洗有機助焊劑，專為波峰焊接傳統和表麵貼裝電路板組件而設計。這種助焊劑消除了傳統助焊劑表麵貼裝組裝波峰焊接操作中經常遇到的缺陷。這種非腐蝕性和非導電性焊劑具有*低的固含量。焊接後組件上基本上冇有殘留物。冇有殘留物乾擾電氣測試並且消除了清潔費用
詳情介紹：

PRODUCT DETAILS


Series :  920-CXF

Item Name :  Soldering Flux

Short Desc :  FLUX,920-CXF,SM 1GL

UNSPSC :  23271808

PCB assemblies are dry as they exit the wave solder machine. The surface insulation resistance is higher than that provided by typical organic water soluble fluxes. Electrical reliability of the assembly is assured. This flux formulation is suitable for soldering bare copper and solder plated circuit boards. It is advised that bare copper boards be free of excessive oxides and other contamination for optimum soldering performance.


產品詳情


係列：920-CXF

商品名稱：焊劑

簡短說明：FLUX，920-CXF，SM 1GL

UNSPSC：23271808

PCB組件在離開波峰焊機時是乾燥的。表麵絕緣電阻高於典型的有機水溶性助焊劑。確保組件的電氣可靠性。該助焊劑配方適用於焊接裸銅和鍍錫電路板。建議裸銅板不含過多的氧化物和其他汙染物，以獲得*佳的焊接性能。



SPECS



Design & Construction
Form Liquid 
Color Light Yellow 
Flux Type No-Clean 
Performance Details
Vapor Pressure 43  hPa
General Features
Shelf Life 12 Months 
Storage Temperature 10 to 25 deg C 
Environmental Condition
Temperature Rating 82  deg C
Chemical Properties
VOC 753  g/L
Chemical Composition Isopropanol, Adipic acid, Rosin Modified, 2-Phenoxyethanol 
Flux Formula 920-CXF 
Specific Gravity 0.8 
Supporting Information
RoHS Info 2015/863 Directive 
Flux Designator ORL0 
Physical Properties
Container Size 1  gal
Container Type Bottle 
Odor/Scent Alcohol 


眼鏡



設計與施工
形成 液體 
顏色 淡黃色 
助焊劑類型 免洗 
表現詳情
蒸汽壓力 43 hPa
一般特征
保質期 12個月 
貯存溫度 10至25攝氏度 
環境條件
溫度等級 82攝氏度
化學性質
VOC 753克/升
化學成分 異丙醇，己二酸，鬆香改性，2-苯氧基乙醇 
助焊劑配方 920-CXF 
比重 0.8 
支持信息
RoHS信息 2015/863指令 
Flux指示器 ORL0 
物理特性
集裝箱尺寸 1加侖
集裝箱類型 瓶子 
氣味/香味 醇 




FEATURES & APPLICATIONS


Features :



  • Essentially no residue left behind after soldering
  • Eliminates expense of cleaning
  • Boards are dry as they exit the wave solder machine
  • Non-corrosive and halogen-free
  • No surface insulation resistance degradation
  • No offensive odors given off during soldering
  • Temperature rating of 82 to 110 deg C
  • Vapor pressure of 43 hPa at 20 deg C



功能和應用


特點：



  • 焊接後基本上冇有留下任何殘留物
  • 消除清潔費用
  • 當焊盤離開波峰焊機時，它們是乾燥的
  • 無腐蝕性和無鹵素
  • 無表麵絕緣電阻降低
  • 在焊接過程中不會散發令人不快的氣味
  • 溫度額定值為82至110攝氏度
  • 蒸氣壓在20℃時為43hPa


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