1630 Inorganic Water-Soluble Soldering Flux 1630無機水溶性焊劑 KES163053G 峰源隆國際貿易（上海）有限公司

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產品名稱：1630 Inorganic Water-Soluble Soldering Flux 1630無機水溶性焊劑
產品型號：KES163053G
產品廠商：美國EIS
產品文檔：

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簡單介紹：

1630 is a water-soluble liquid flux for heat sink applications. It is a bromide based, chloride-free, inorganic salt activated flux containing less than 1% free of acid. 1630 is an excellent flux for soldering copper, brass and all types of tin-based solders from low tin to lead-free solders. 1630是一種用於散熱器應用的水溶性液體助焊劑。它是一種基於溴化物，不含氯化物的無機鹽活化助焊劑，含有少於1％的酸。1630是焊接銅，黃銅和所有類型錫基焊料的上等助焊劑，從低錫到無鉛焊料。

詳情介紹：

PRODUCT DETAILS

Series : 1630

Item Name : Soldering Flux

UNSPSC : 23271808

1630 has a bromide activator that will not turn copper or brass green during normal soldering operations. 1630 is also used for soldering nickel and mild steel. 1630 was developed for soldering electrical connections like fuses, and can be used to solder all copper based alloy joints. The inorganic salt activation system gives 1630 great heat stability over a long period of time using a wide variety of heating techniques.

產品詳情

係列：1630

商品名稱：焊劑

UNSPSC：23271808

1630具有溴化物活化劑，在正常焊接操作期間不會變銅或黃銅。1630也用於焊接鎳和低碳鋼。1630開發用於焊接保險絲等電氣連接，可用於焊接所有銅基合金接頭。無機鹽活化係統使用各種加熱技術在很長一段時間內提供1630優良的熱穩定性。

FEATURES & APPLICATIONS

Features :

High activity for soldering most metals
Will not discolor copper and brass
Excellent heat stability
Classified as INH1 per IPC J-STD-004

Applications :

1630 is usually applied by brush or dip method at room temperature. If the flux tank is heated, it might be necessary to make water additions to maintain the specific gravity.
Water-Soluble Liquid Flux for Heat Sink Applications

功能和應用

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