186 Rosin Mildly Activated Soldering Flux 186鬆香輕度活化焊錫助焊劑 KES1865G 峰源隆國際貿易（上海）有限公司

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產品名稱：186 Rosin Mildly Activated Soldering Flux 186鬆香輕度活化焊錫助焊劑
產品型號：KES1865G
產品廠商：美國EIS
產品文檔：

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簡單介紹：

The 186, under MIL-F-14256, was QPL approved as type RMA. Although the fluxing ability approaches that of type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186 rosin flux has been developed for use in critical applicatio 根據MIL-F-14256，186被QPL批準為RMA型。雖然助焊劑能力接近RA助焊劑的助焊劑能力，但焊接後的助焊劑殘留物是非腐蝕性和不導電的。186鬆香助焊劑已經開發用於要焊接困難組件的關鍵應用，但工藝要求規定使用RMA助焊劑類型。該焊劑具有高熱穩定性，用於焊接需要高預熱溫度的多層組件

詳情介紹：

PRODUCT DETAILS

Series : 186

Item Name : Soldering Flux

UNSPSC : 23271808

Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.

產品詳情

係列：186

商品名稱：焊劑

UNSPSC：23271808

暴露於高預熱溫度不會降低殘留物在正常清潔溶劑中的溶解度。焊劑殘留物不會引起表麵絕緣電阻降低。使用*少量的離子活化劑和殘餘物的無活性使得殘留物留在電路板組件上用於許多應用。助焊劑殘留物還具有防潮和抗**性。

SPECS

Design & Construction