產品詳情
  • 產品名稱:977 No-Clean Soldering Flux 977免清洗焊劑

  • 產品型號:KES97753G
  • 產品廠商:美國EIS
  • 產品文檔:
你添加了1件商品 查看購物車
簡單介紹:
The 977 is an organic water soluble, water-based, no-clean chemistry for high quality soldering of electronic circuit board assemblies. Designed for wave soldering applications, 977 provides good wetting on most surface finishes. The flux was specifically desig 977是一種有機水溶性,水基,免清洗化學品,用於電子電路板組件的高質量焊接。專為波峰焊應用而設計,977可在大多數表麵處理上提供良好的潤濕性。助焊劑專門設計用於減少橋接,這通常與不含VOC,免清洗的助焊劑有關。977具有出色的焊接性能,可在不犧牲組件可靠性的情況下提高生產率
詳情介紹:

PRODUCT DETAILS


Series :  977

Item Name :  Soldering Flux

UNSPSC :  23271808

The flux leaves bright shiny solder joints and will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. The minimal amount of residue remaining after soldering is non-conductive, non-corrosive and does not need to be removed. The residues left after soldering will not interfere with in-circuit testing. 977 is not detrimental to the Surface Insulation Resistance (SIR) of the soldered assembly.


產品詳情


係列:977

商品名稱:焊劑

UNSPSC:23271808

焊劑留下明亮的光亮焊點,不會攻擊適當固化的焊接掩模或FR-4環氧玻璃層壓板。焊接後剩餘的少殘留物是不導電的,無腐蝕性的,不需要去除。焊接後留下的殘留物不會乾擾在線測試。977對焊接組件的表麵絕緣電阻(SIR)無害。



SPECS



Design & Construction
Form Liquid 
Color Clear 
Flux Type No-Clean 
Performance Details
Vapor Pressure 23  hPa
General Features
Shelf Life 36 Months 
Storage Temperature 4 to 25 deg C 
Environmental Condition
Temperature Rating 90  deg C
Chemical Properties
Chemical Composition Organic Acid, Proprietary Glycol Mixture, Water 
Flux Formula 977 
Specific Gravity 1.012 
Supporting Information
RoHS Info 2015/863 Directive 
Flux Designator ORL0 
Physical Properties
Odor/Scent Mild 


眼鏡



設計與施工
形成 液體 
顏色 明確 
助焊劑類型 免洗 
表現詳情
蒸汽壓力 23 hPa
一般特征
保質期 36個月 
貯存溫度 4至25攝氏度 
環境條件
溫度等級 90攝氏度
化學性質
化學成分 有機酸,專有的乙二醇混合物,水 
助焊劑配方 977 
比重 1.012 
支持信息
RoHS信息 2015/863指令 
Flux指示器 ORL0 
物理特性
氣味/香味 溫和 




FEATURES & APPLICATIONS


Features :



  • Biodegradable at pH of 2 or greater
  • Chemically compatible with most solder masks and board laminates
  • Does not degrade surface insulation resistance
  • No offensive odors
  • Bright, shiny solder connections
  • Temperature rating of 90 to 115 deg C
  • Vapor pressure of 23 hPa at 20 deg C



功能和應用


特點:



  • 在pH為2或更高時可生物降解
  • 與大多數焊接掩模和板層壓板在化學上兼容
  • 不會降低表麵絕緣電阻
  • 冇有令人不快的氣味
  • 明亮,有光澤的焊接連接
  • 溫度額定值為90至115攝氏度
  • 蒸氣壓在20℃時為23hPa


滬公網安備 31010902002433號