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  • 产品名称：钻石切片/威化刀片

  • 产品型号：812-310
  • 产品厂商：其它品牌
  • 产品文档：
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简单介绍：
Diamond Sectioning / Wafering Blades
详情介绍：

Diamond Sectioning / Wafering Blades

Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

  • Faster cutting action – leaves smooth finish
  • Less glazing – requires minimal dressing
  • More universal – compatible with a greater variety of materials
     

All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" arbor holes. Three grades are offered to fit most applications:

  • LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
  • HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
  • HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

Prod #

Description

Unit

1/2" Arbor Hole for Buehler, Struers, Allied and many others

812-310

Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/fine grit - low concentration

each

812-311

Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/coarse grit - high concentration

each

812-312

Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, fine grit - high concentration

each

812-315

Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration

each

812-316

Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration

each

812-317

Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration

each

812-320

Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration

each

812-321

Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration

each

812-324

Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration

each

812-325

Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration

each

812-326

Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration

each

812-327

Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration

each

5/8" Arbor Hole for PELCO XP-300, PELCO CS600A and PCS-400

812-316-5

Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration

each

812-317-5

Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration

each

812-326-5

Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/coarse grit - high concentration


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