产品详情
  • 产品名称:XP精密切片锯和金刚石切片/威化刀片

  • 产品型号:812-300
  • 产品厂商:其它品牌
  • 产品文档:
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简单介绍:
Manual, precision sectioning saw designed for cutting printed circuit boards, ceramics, metal samples and composite components. Can also be used as a precision cut-off saw for small rods, wirs, bars a
详情介绍:

XP精密切片锯和金刚石切片/威化刀片

Prod # Description Unit

812-300
XP Precision Sectioning Saw, each
each

Diamond Sectioning / Wafering Blades

Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

  • Faster cutting action – leaves smooth finish
  • Less glazing – requires minimal dressing
  • More universal – compatible with a greater variety of materials
     

All Smart Cut™ diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6" diameter with the industry standard 1/2" or 5/8" arbor holes. Three grades are offered to fit most applications:

  • LC200MF medium/fine grit – low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
  • HC150MC medium/coarse grit - high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
  • HC320F fine grit – high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)
Prod # Description Unit
1/2" Arbor Hole for Buehler, Struers, Allied and many others
812-310
Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/fine grit - low concentration
each
812-311
Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, medium/coarse grit - high concentration
each
812-312
Diamond Wafering Blade, 3" x 0.010" x 1/2" hole, fine grit - high concentration
each
812-315
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/fine grit - low concentration
each
812-316
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration
each
812-317
Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, fine grit - high concentration
each
812-320
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/fine grit - low concentration
each
812-321
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, medium/coarse grit - high concentration
each
812-324
Diamond Wafering Blade, 5" x 0.015" x 1/2" hole, fine grit - high concentration
each
812-325
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/fine grit - low concentration
each
812-326
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, medium/coarse grit - high concentration
each
812-327
Diamond Wafering Blade, 6" x 0.020" x 1/2" hole, fine grit - high concentration
each
5/8" Arbor Hole for PELCO XP-300, PELCO CS600A and PCS-400
812-310-5
Diamond Wafering Blade, 3" x 0.010" x 5/8" hole, medium/fine grit - low concentration
each
812-311-5
Diamond Wafering Blade, 3" x 0.010" x 5/8" hole, medium/coarse grit - high concentration
each
812-312-5
Diamond Wafering Blade, 3" x 0.010" x 5/8" hole, fine grit - high concentration
each
812-315-5
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/fine grit - low concentration
each
812-316-5
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, medium/coarse grit - high concentration
each
812-317-5
Diamond Wafering Blade, 4" x 0.012" x 5/8" hole, fine grit - high concentration
each
812-320-5
Diamond Wafering Blade, 5" x 0.015" x 5/8" hole, medium/fine grit - low concentration
each
812-321-5
Diamond Wafering Blade, 5" x 0.015" x 5/8" hole, medium/coarse grit - high concentration
each
812-324-5
Diamond Wafering Blade, 5" x 0.015" x 5/8" hole, fine grit - high concentration
each
812-325-5
Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/fine grit - low concentration
each
812-326-5
Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, medium/coarse grit - high concentration
each
812-327-5
Diamond Wafering Blade, 6" x 0.020" x 5/8" hole, fine grit - high concentration
each
812-630
Diamond Blade for ceramics, composites, 6 x 0.019 x 5/8" hole
each
812-632
Diamond Blade for geological use, 6 x 0.020 x 5/8" hole
each
812-640
Borazon Blade for Nickel and Cobalt alloys, 6 x 0.019 x 5/8" hole
each

cutting fluid, soluble oil (recommended)

SO type, water base, anti corrosive, mix 1:40 water
Prod # Description Unit
812-650
Cutting Fluid, Soluble Oil
1 quart
812-653
Cutting Fluid, Soluble Oil
1 gallon
Cutting Fluid, Non-soluble Oil
Prod # Description Unit
812-656
Cutting Fluid, Non-soluble Oil
1 quart
Dressing Sticks
Prod # Description Unit
812-422
Dressing Sticks for Abrasive Blades
each
812-420
Dressing Sticks for Diamond Blades
each

 

 

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