产品名称：Substratek™TEM Substrates

Substratek™ TEM Substrates are ultrathin metallic support films on standard 3mm TEM grids. These metallic films are specially manufactured with a patented process (US Patent #7348570 B2, March 25, 2008) as experimental platforms and are electron transparent to allow for imaging using a TEM. The ultrathin Substratek™ TEM Substrates enable electrochemical processing, crystal growth, and nano- and micro-fabrication directly on the substrates. They allow for subsequent TEM examination without the need for extensive sample preparation. Direct nanoscale imaging without extensive TEM preparation does not require expensive thinning tools, it saves time and it avoids introduction of preparation artifacts. Compared to the widely used carbon support films, ultrathin and electron transparent metallic films have a high surface energy and therefore more suitable for fabrication processes.

Important properties of the ultrathin Substratek™
Metallic Support Films are:
Electron transparent with a 2-3nm thickness
Small feature sizes do not obscure sample features
Chemically stable (can be used for electroplating)
Robust enough to act as substrates
High surface energy.
They are ideally suited for use as integrated research
platforms for applications as diverse as:
Nanofabrication
Electron-beam lithography
Micro-contact printing
Electrochemistry or electroplating
Nano-crystal growth
Carbon nano tubes
X-ray analysis of carbon containing materials
Surface and interface science
 

The Substratek™ TEM Substrates are metallic ultrathin films on a standard 3mm TEM grid. Available substrate are Au, Pt, Pd (2-3nm thickness) and TiOx (10-20nm thickness) on 300 and 400mesh TEM grids. The Au, Pt and Pd substrates are deposited on gold TEM grids compatible with electrochemical processes. The TiOx substrate is deposited on copper TEM grids; These materials have proven to be stable substrates with a small feature size in the support film. The TiOx substrate is more bio-compatible and can also be used for life-science applications. They are supplied in a PELCO^® 160 TEM grid box in quantities of 25 per box.
TEM substrates on 400 mesh TEM grids
 

Prod #	Description	Unit

21410-25

Substratek™, 2-3nm Pt on 400 mesh Au TEM grid

pkg/25

21420-25

Substratek™, 2-3nm Au on 400 mesh Au TEM grid

pkg/25

21430-25

Substratek™, 2-3nm Pd on 400 mesh Au TEM grid

pkg/25

21440-25

Substratek™, 10-20nm TiOx on 400 mesh Cu TEM grid

pkg/25

TEM substrates on 300 mesh TEM grids
G300: Pitch 83µm; Hole Width 58µm; Bar Width 25µm; Transmission 49%

Prod #	Description	Unit

21310-25

Substratek™, 2-3nm Pt on 300 mesh Au TEM grid

pkg/25

21320-25

Substratek™, 2-3nm Au on 300 mesh Au TEM grid

pkg/25

21330-25

Substratek™, 2-3nm Pd on 300 mesh Au TEM grid

pkg/25

21340-25

Substratek™, 10-20nm TiOx on 300 mesh Cu TEM grid

pkg/25