产品详情
  • 产品名称:用于TEM的PELCO®二氧化硅支撑膜

  • 产品型号:21532
  • 产品厂商:其它品牌
  • 产品文档:
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简单介绍:
These PELCO® membranes of Silicon Dioxide (SiO2) offer superior flatness. Using advanced MEMS manufacturing technologies combined with novel stress-reducing techniques, we have been able to provide Si
详情介绍:

The Silicon Dioxide (SiO2) Support Films are manufactured using the PELCO® 200nm Silicon Nitride (Si3N4) Support Films with the 0.5 x 0.5mm window on a perfectly round 3mm Si frame as a platform. The silicon dioxide support films consist of pure and amorphous thermal SiO2 membrane. The 0.5 x 0.5mm membrane is patterned into 24 ea. apertures with a size varying between 50 x 50µm to 70 x 70µm and etched back to the thermally-deposited Silicon Dioxide leaving a structure-free SiO2 thin membrane of 40nm, 18nm or 8nm, suspended by a 200nm optically transparent (Si3N4) support mesh. The bar size between the SiO2 apertures is 25-35µm and the boundary width is 25-55µm. The design of the mesh and the ratio of mesh suspension and Silicon Dioxide Film has been optimized to enable flat Silicon Dioxide Support Films with a size of 50 x 50µm to 70 x 70µm. The result is a Silicon Dioxide membrane with a truly superior flatness, ideal for TEM imaging. In the unique design of this PELCO® product, the compression in the SiO2 film is balanced by the stress in the Si3N4 grid structure. The mesh size of the Silicon Dioxide Support Films is comparable to the area size found on most 300 and 400 mesh TEM grids and is considered to be a practical size for many applications. There are 24 fields of SiO2 support films on each frame. The boundary of 200nm Si3N4 membrane leaves ample area for experiments on Si3N4.
Examples of applications are:
Nanomaterial deposition and growth.
Thin film analysis and characterization.
Catalyst research and development.
Support for FIB lamellae.
Characterization of semiconductor materials.
Study of attached biological molecules.
Product specifications
Defining parameters for the PELCO® Silicon Dioxide Support Films are:
Membrane Thickness: 40nm, 18nm and 8nm.
Aperture Size / Number: 50 x 50µm/24 apertures for 40nm, 60 x 60µm/24 apertures for 18nm and 70 x 70µm/24 apertures for 8nm.
Pattern: 5 rows x 5 columns with 200nm Si3N4 grid support structure, 35µm bar and 55µm edge for 40nm, 35µm bar and 30µm edge for 18nm and 25µm bar and 25µm edge for 8nm..
Total Window Area: 0.5 x 0.5mm.
Frame Thickness: Silicon support structure is 200µm standard. This allows for fitting in standard TEM holders and gives a sturdy support frame.
Surface Roughness: The RMS (Rq) is 65nm which gives a mean roughness (Ra) of 41 nm.
Frame Diameter: TEM standard 3mm diameter disc, fully compatible with regular TEM holders and with EasyGrip™ edges for improved handling.
Packaging: The PELCO® Silicon Dioxide Support Films are packaged under cleanroom conditions in the PELCO® #160 TEM Grid Storage Box. Each box holds 10 support films. 
Prod # Description Unit
21532-10
Silicon Dioxide Support Film, 8nm, 70 x 70µm apertures (24) on 0.5 x 0.5mm Window, Ø3mm
pkg/10
21531-10
Silicon Dioxide Support Film, 18nm, 60 x 60µm apertures (24) on 0.5 x 0.5mm Window, Ø3mm
pkg/10
21530-10
Silicon Dioxide Support Film, 40nm, 50 x 50µm apertures (24) on 0.5 x 0.5mm Window, Ø3mm
pkg/10

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