产品名称：用于TEM的PELCO®氮化硅支撑膜

Silicon Nitride Support Films have the advantages of being chemically and mechanically robust and can withstand temperature changes up to 1000°C. They are extremely stable and suitable to conduct a variety of nanotechnology experiments with particles or cells mounted directly on the support films.

The PELCO® Silicon Nitride Support Films are indispensable tools for virtually all fields of nanotechnology research. They enable direct deposition and in situ observations of dynamic reactions over a wide temperature range. The support film can be used as a passive support film but can also play a role as an active participant in experiments.
 

Iron nanoparticles dispersed on a SiN support film and oxidized at 350°C while supported on the PELCO® SiN support films. The image shows the product of the oxidization process: hollow iron oxide nanoparticles.
Haitao Liu, Dept. of Chemistry, UC Berkeley, California.
PELCO® Silicon Nitride Support Films are manufactured using state-of-the-art semiconductor and MEMS manufacturing techniques. The Silicon Nitride Support Film is grown on a silicon wafer to the desired membrane thickness of 8, 15, 50, or 200nm. The specimen viewing area is created by etching away a window in the silicon substrate, leaving a perfectly smooth, resilient and chemically robust silicon nitride film. The frame is manufactured as a 3mm silicon disc with smooth EasyGrip™ edges for easy manipulation by tweezers and will fit perfectly in standard TEM holders. Standard thickness of the silicon frame is 200µm which will fit most TEM holders. A special version with a 50µm thickness and a 0.25 x 0.25mm window is available for special TEM holders which only accomadate thinner supports. Easy handling capabilities and smoothness of the edges are design advantages over other brands of silicon nitride support films. The PELCO® Silicon Nitride Support Films are manufactured like grids and are completely free from debris particles. The mechanical and chemical stability allow for cleaning of the Silicon Nitride Support Films with chemicals (solvents, acids and bases), glow discharge and plasma cleaning. It is recommended that ultrasonic cleaning not be used, as it can easily shatter the Silicon Nitride Support Films.
Advantages of the PELCO® Silicon Nitride Support Films

Resilient, ultra-low-stress 8, 15 or 50nm Silicon Nitride Support Film
The relatively sturdy Silicon Nitride Support Film allows direct deposition of materials and/or manipulation of specimens
Largest viewing area for 50nm film thickness
8 and 15nm film thickness without pinholes for ultra high resolution TEM applications

Robust, low-stress 200nm Silicon Nitride Support Film
Stronger membrane for multiple handling

Special window for TEM tomography applications
Large (0.5x1.5mm) windows designed primarily for high-tilt tomography applications allowing up to 75° tilt

Multiple window version
2 separate 0.1 x 1.5mm windows on one single frame
3x3 array gives 9 separate 0.1 x 0.1mm windows on one single frame

Multiple microscopy techniques capability
The mechanical stability allows for multiple microscopy techniques like TEM, SEM, EDX, XPS and AFM on the same silicon nitride support film.

Films are resistant to solvents, acids and bases
Specimen can be studied, synthesized or manipulated under acidic or basic conditions

Silicon Nitride Support Films are ideal for high temperature experiments
Films withstand temperatures up to 800° C and can be extended to 1000° C

The PELCO® Silicon Nitride Support Films provide more accurate analysis of specimens containing carbon, and reduce contamination
Carbon-free background for TEM imaging and analysis

Films can be easily cleaned
The mechanical and chemical stability allow the Silicon Nitride Support Films to be easily cleaned using glow discharge of plasma cleaning techniques

Ultra-flat background support film
Ideal substrate for deposition of nanoparticles and thin films
Perfect for SEM imaging due to the absence of background structure

Clean manufacturing avoids debris particles on support films
The PELCO® Silicon Nitride Support Films have no broken edges and are free from debris. Furthermore they are packaged under class 100 (US Fed Standard 209E) clean room conditions

Frame thickness of 200 and 50µm
200µm for standard TEM grid holders
50µm for special TEM grid holders

Industry standard 3mm diameter round frame
Fits exactly in standard TEM holders and provides EasyGrip™ edges for handling. Also provides a more sturdy silicon frame.