产品名称：HM531-6236-90 Type 3 Solder Paste HM531-6236-90 3型焊膏

PRODUCT DETAILS

Series :  HM531-6236-90

Item Name :  Solder Paste

UNSPSC :  23271816

The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCBs and PdAg components. The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water soluble solder paste for any application.

产品详情

系列：HM531-6236-90

商品名称：焊膏

UNSPSC：23271816

HM531中的活化剂包非常具有侵蚀性，可为OSP涂层的PCB和PdAg组分提供润湿性。批次一致性，抗塌落性，一致的印刷量，可焊性和可清洁性使HM531成为适用于任何应用的理想水溶性焊膏。

FEATURES & APPLICATIONS

Features :

• stencil life of 8+ hr
• Capable of 60+ min idle times in printing
• Capable of print speeds up to 150 mm/sec (6 Inch/sec)
• Contains halogen
• Compatible with enclosed print head systems
• Excellent anti-slump characteristics minimizing bridging defects
• Excellent solderability to a wide variety of metallizations, including palladium, leaving bright, shiny joints
• HM531 provides outstanding batch to batch consistency
• Minimal foam in wash systems
• Produces minimal voiding underneath BGA components
• Residues easily removed with hot DI water, even up to 48 hr after soldering
• Metals percentage of 90%
• Melting range of 179 to 189 deg C
• Temperature rating of 21 to 25 deg C

Applications :

• For Stencil Printing Applications

功能和应用

特点：

• 模板寿命为8小时以上
• 打印时可以有60多分钟的空闲时间
• 打印速度可达150毫米/秒（6英寸/秒）
• 含有卤素
• 兼容封闭式打印头系统
• 抗塌落特性，大限度地减少桥接缺陷
• 对各种金属化（包括钯）具有可焊性，可留下明亮，有光泽的接缝
• HM531提供批次间一致性
• 洗涤系统中泡沫少
• 在BGA组件下产生小的空洞
• 使用热DI水可轻松去除残留物，甚至在焊接后48小时
• 金属百分比为90％
• 熔化范围为179至189摄氏度
• 温度等级为21至25摄氏度

应用：

• 用于模板印刷应用