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  • 产品名称：EPO-TEK H70E Thermally Conductive Epoxy 环氧树脂胶粘剂

  • 产品型号：16017
  • 产品厂商：其它品牌
  • 产品文档：
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简单介绍：
EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adh
详情介绍：

EPO-TEK® H70E Thermally Conductive Epoxy

环氧树脂胶粘剂

环氧树脂粘合剂

环氧树脂胶（**胶）

导热绝缘环氧树脂胶粘剂

环氧胶粘剂（大力胶）

EPO-TEK® H70E是一种双组份、导热绝缘的环氧树脂，设计来满足微电子和光电子芯片的粘接应用。它是非常优良的散热粘合剂，尤其**使用在需要良好散热的应用上。它具有优异的操作性能，在室温下拥有*长的粘附寿命。使用非常简便；可以丝网印制，机器分配和印花或者手工实施。拥有优良的粘附力，可以粘附于铁或者非铁类金属、玻璃、陶瓷、可伐合金以及印刷电路板。凝固非常迅速。


EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed. EPO-TEK® H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature. Easy to use; can be screen printed, machine dispensed, stamped or hand applied. Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB. Can be cured very rapidly.

Cure Schedule (minimum bond temperature/time)
175ºC……..1 Minute
150ºC……..5 Minutes
120ºC… ..15 Minutes
80ºC… ..90 Minutes

Properties (summary)

  • Color : Grey / Beige
  • Consistency: Slightly Pourable Paste
  • Viscosity: 4,000 – 7,000 cps
  • Thermal Conductivity: 0.9 W/mK
  • Operating Temperature: -55ºC to 200ºC (-67ºF to 392ºF)
  • Pot Life
    Prod # Description Unit
    16017
    		EPO-TEK® H70E Epoxy, 85g (3 oz.)
    each

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