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  • 产品名称：M-Bond 610

  • 产品型号：16039
  • 产品厂商：其它品牌
  • 产品文档：
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简单介绍：
M-BOND™ 610 Adhesive ion milling, cross-sectioning 这是一个不导电的双组分的溶剂稀释剂，环氧酚醛类粘合剂可以用于高性能的研究。耐化学性的，并提供一薄层胶，它具有良好的离子铣性能。
详情介绍：

M-BOND™ 610 Adhesive

ion milling, cross-sectioning

This is a non-conductive, two-component, solvent-thinned, epoxy-phenolic adhesive for high performance applications. Chemically resistant and provides a thin layer of glue which has good ion milling properties. It has low viscosity and is extremely thin, with minimum creep, hysteresis and linearity problems. Solids content is 22%. It is an excellent adhesive for mounting samples for TEM dimpling and bonding of samples to TEM grids for imaging or FIB.
Operating temperature range, short term is -269° to +370°C; long term, -269° to +260°C.
Elongation can occur at +24°C (3%). This may be the widest temperature range general-purpose adhesive that is available.
A kit contains: 4 bottles (14g each) Resin, 4 bottles (11g each) Curing Agent, 4 brush caps for dispensing mixed adhesives, 4 disposable mixing funnels and instructions.

这是一种非导电双组分溶剂稀释环氧酚醛胶粘剂，适用于高性能应用。 耐化学腐蚀，并提供一层具有良好离子铣削性能的胶水。 它粘度低，*薄，具有*小的蠕变，滞后和线性问题。 固体含量为22％。 这是一种优异的粘合剂，用于安装用于TEM成像或FIB的TEM凹坑和样品粘合到TEM网格的样品。
Prod # Description Unit
16039
M-Bond™ 610, complete kit
each

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