BGA Pad Circuit Frame CBGA焊盘电路框架 CS020025AT 桑戈国际贸易（上海）有限公司

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产品名称：BGA Pad Circuit Frame CBGA焊盘电路框架
产品型号：CS020025AT
产品厂商：美国EIS
产品文档：

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简单介绍：

Medic CS020025AT is a circuit frame BGA pad with tin and lead plating and is not RoHS compliant. Additionally, CIR CS015020AT allows users to replace damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a Medic CS020025AT是一种电路框架BGA焊盘，镀锡和铅镀层，不符合RoHS标准。此外，CIR CS015020AT允许用户在几分钟内更换损坏的表面贴装焊盘，焊盘和导体，而无需液体环氧树脂，粘接强度等于原始粘接强度

详情介绍：

PRODUCT DETAILS

Item Name : Circuit Frame

Short Desc : CIRCUIT FRAME, BGA PADS, .020/.025

UNSPSC : 23271700

This item features dry-film adhesive backing which make this circuit board repair procedure easy, fast and highly reliable. This is a reliable IPC recommended procedure which meets the highest conformance level for this type of repair.

产品详情

商品名称：电路框架

简短描述：CIRCUIT FRAME，BGA PADS，.020 / .025

UNSPSC：23271700

该产品采用干膜背胶，使电路板修复过程简单，快速，高度可靠。这是一种可靠的IPC**程序，可满足此类维修的高一致性要求。

SPECS

Design & Construction

Finish	Tin/Lead
Material	Rolled Annealed Copper Foil Base, B-Staged Modified Acrylic Film Adhesive Backing

General Features

Shelf Life	12 Months
Type	BGA Pad

Physical Properties

Dimensions

2.25 Inch L x 1.5 Inch W Frame

眼镜

设计与施工

完	锡/铅
材料	轧制退火铜箔基，B级改性丙烯酸薄膜粘合剂背衬

一般特征

保质期	12个月
类型	BGA垫

物理特性

外形尺寸	2.25英寸L x 1.5英寸W框架

FEATURES & APPLICATIONS

Features :

Imagine replacing damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes
Circuit frames with dry film adhesive backing make this delicate repair procedure easy, fast and highly reliable
This reliable IPC recommended procedure meets the highest conformance level for this type of repair
For over 30 years circuit frames have been used by thousands of commercial, medical and military manufacturers around the globe
0.02 Inch x 0.025 Inch pad size