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  • 产品名称：Soder-Wick® 50 Rosin Activated Desoldering Braid Soder-Wick®50松香活性脱毛编织物

  • 产品型号：50-1-25
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
Soder-Wick 50 offers the state of the art in desoldering technology. Soder-Wick is designed for today's heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick 50提供了脱焊技术的新技术。Soder-Wick专为当今的热敏电子元件而设计，采用质量轻，纯铜编织结构，即使在低温下也能提供更好的导热性。
详情介绍：

PRODUCT DETAILS


Trade Name :  Soder-Wick®

Series :  50

Item Name :  Desoldering Braid

UNSPSC :  23271803

Soder-Wick 50 responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. A full range of sizes and flux types are available, including Rosin, no-clean, unfluxed and a high temperature Lead-Free version.


产品详情


商品名称：Soder-Wick®

系列：50

商品名称：脱焊辫子

UNSPSC：23271803

Soder-Wick 50比传统的拆焊辫子响应更快，从而大限度地减少过热并防止PCB损坏。提供各种尺寸和助焊剂类型，包括松香，免清洗，不褪色和高温无铅版本。



SPECS



Design & Construction
Flux Type Rosin Activated 
Material Copper 
Spool Type Bobbin 
General Features
Shelf Life 24 Months 


眼镜



设计与施工
助焊剂类型 松香活化 
材料 铜 
线轴类型 筒管 
一般特征
保质期 24个月 




FEATURES & APPLICATIONS


Features :



  • Minimizes the risk of damage associated with static electricity
  • Non-corrosive ultra high purity type R rosin flux
  • Will not leave ionic contamination on the boards
  • Optimized construction for faster wicking and heat transfer
  • Halide free


Applications :



  • For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script



功能和应用


特点：



  • 大限度地降低与静电相关的损坏风险
  • 非腐蚀性*高纯型R松香助焊剂
  • 不会在板上留下离子污染
  • 优化的结构，可加快芯吸和传热
  • 无卤化物


应用：



  • 用于通孔元件，表面贴装器件焊盘，BGA焊盘，微电路，端子，接线片和接杆以及识别脚本



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