产品详情
  • 产品名称:979 No-Clean Soldering Flux 979免清洗焊剂

  • 产品型号:KES97953G
  • 产品厂商:美国EIS
  • 产品文档:
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简单介绍:
The 979 is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of electronic circuit board assemblies. This flux's finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. 979 also reduces 979是一种不含VOC,免清洗助焊剂配方,用于电子电路板组件的高质量,低缺陷焊接。这种助焊剂经过精细调节的活化系统可提供无VOC液体助焊剂技术和*闪亮焊点的*佳润湿效果。979还减少了光泽层压板和连接器引脚之间的微焊球
详情介绍:

PRODUCT DETAILS


Series :  979

Item Name :  Soldering Flux

UNSPSC :  23271808

979 will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. 979 leaves a minimal amount of residue after soldering. All remaining residues are non-corrosive, non-conductive and do not need to be removed.


产品详情


系列:979

商品名称:焊剂

UNSPSC:23271808

979不会攻击正确固化的焊接掩模或FR-4环氧玻璃层压板。焊接后979留下少量残留物。所有剩余的残留物都是非腐蚀性的,不导电的,不需要去除。



SPECS



Design & Construction
Form Liquid 
Color Clear 
Flux Type No-Clean 
Performance Details
Vapor Pressure 23  hPa
General Features
Shelf Life 12 Months 
Storage Temperature 4 to 25 deg C 
Environmental Condition
Temperature Rating 90  deg C
Chemical Properties
Chemical Composition Aliphatic Carboxylic Acid, Bis(2-(2-Methoxyethoxy)Ethyl) Ether, Water 
Flux Formula 979 
Specific Gravity 1.02 
Supporting Information
RoHS Info 2011/65/EU Directive 
Flux Designator ORL0 
Physical Properties
Odor/Scent Mild 


眼镜



设计与施工
形成 液体 
颜色 明确 
助焊剂类型 免洗 
表现详情
蒸汽压力 23 hPa
一般特征
保质期 12个月 
贮存温度 4至25摄氏度 
环境条件
温度等级 90摄氏度
化学性质
化学成分 脂肪族羧酸,双(2-(2-甲氧基乙氧基)乙基)醚,水 
助焊剂配方 979 
比重 1.02 
支持信息
RoHS信息 2011/65 / EU指令 
Flux指示器 ORL0 
物理特性
气味/香味 温和 




FEATURES & APPLICATIONS


Features :



  • Biodegradable at pH of 2 or greater
  • Chemically compatible with most solder masks and board laminates
  • Does not degrade surface insulation resistance
  • No offensive odors
  • Bright, shiny solder connections
  • Temperature rating of 90 to 115 deg C
  • Vapor pressure of 23 hPa at 20 deg C



功能和应用


特点:



  • 在pH为2或更高时可生物降解
  • 与大多数焊接掩模和板层压板在化学上兼容
  • 不会降低表面绝缘电阻
  • 没有令人不快的气味
  • 明亮,有光泽的焊接连接
  • 温度额定值为90至115摄氏度
  • 蒸气压在20℃时为23hPa


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