产品详情
  • 产品名称:977 No-Clean Soldering Flux 977免清洗焊剂

  • 产品型号:KES97753G
  • 产品厂商:美国EIS
  • 产品文档:
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简单介绍:
The 977 is an organic water soluble, water-based, no-clean chemistry for high quality soldering of electronic circuit board assemblies. Designed for wave soldering applications, 977 provides good wetting on most surface finishes. The flux was specifically desig 977是一种有机水溶性,水基,免清洗化学品,用于电子电路板组件的高质量焊接。专为波峰焊应用而设计,977可在大多数表面处理上提供良好的润湿性。助焊剂专门设计用于减少桥接,这通常与不含VOC,免清洗的助焊剂有关。977具有出色的焊接性能,可在不牺牲组件可靠性的情况下提高生产率
详情介绍:

PRODUCT DETAILS


Series :  977

Item Name :  Soldering Flux

UNSPSC :  23271808

The flux leaves bright shiny solder joints and will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. The minimal amount of residue remaining after soldering is non-conductive, non-corrosive and does not need to be removed. The residues left after soldering will not interfere with in-circuit testing. 977 is not detrimental to the Surface Insulation Resistance (SIR) of the soldered assembly.


产品详情


系列:977

商品名称:焊剂

UNSPSC:23271808

焊剂留下明亮的光亮焊点,不会攻击适当固化的焊接掩模或FR-4环氧玻璃层压板。焊接后剩余的少残留物是不导电的,无腐蚀性的,不需要去除。焊接后留下的残留物不会干扰在线测试。977对焊接组件的表面绝缘电阻(SIR)无害。



SPECS



Design & Construction
Form Liquid 
Color Clear 
Flux Type No-Clean 
Performance Details
Vapor Pressure 23  hPa
General Features
Shelf Life 36 Months 
Storage Temperature 4 to 25 deg C 
Environmental Condition
Temperature Rating 90  deg C
Chemical Properties
Chemical Composition Organic Acid, Proprietary Glycol Mixture, Water 
Flux Formula 977 
Specific Gravity 1.012 
Supporting Information
RoHS Info 2015/863 Directive 
Flux Designator ORL0 
Physical Properties
Odor/Scent Mild 


眼镜



设计与施工
形成 液体 
颜色 明确 
助焊剂类型 免洗 
表现详情
蒸汽压力 23 hPa
一般特征
保质期 36个月 
贮存温度 4至25摄氏度 
环境条件
温度等级 90摄氏度
化学性质
化学成分 有机酸,专有的乙二醇混合物,水 
助焊剂配方 977 
比重 1.012 
支持信息
RoHS信息 2015/863指令 
Flux指示器 ORL0 
物理特性
气味/香味 温和 




FEATURES & APPLICATIONS


Features :



  • Biodegradable at pH of 2 or greater
  • Chemically compatible with most solder masks and board laminates
  • Does not degrade surface insulation resistance
  • No offensive odors
  • Bright, shiny solder connections
  • Temperature rating of 90 to 115 deg C
  • Vapor pressure of 23 hPa at 20 deg C



功能和应用


特点:



  • 在pH为2或更高时可生物降解
  • 与大多数焊接掩模和板层压板在化学上兼容
  • 不会降低表面绝缘电阻
  • 没有令人不快的气味
  • 明亮,有光泽的焊接连接
  • 温度额定值为90至115摄氏度
  • 蒸气压在20℃时为23hPa


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