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  • 产品名称：958 No-Clean Soldering Flux 958免清洗焊剂

  • 产品型号：KES95853G
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
The 958 is a no-clean, non-corrosive liquid flux that is specifically designed for the wave soldering of conventional and surface mount circuit board assemblies. 958 was developed to give excellent soldering performance on bare copper printed circuit boards treated with OSP 958是一种免清洗，无腐蚀性的液体助焊剂，专为传统和表面贴装电路板组件的波峰焊设计。开发958是为了在用OSP涂层处理的裸铜印刷电路板上提供优异的焊接性能。基本上，焊接后没有残留物残留。该助焊剂的主要优点是减少了与焊接过程相关的气味。
详情介绍：

PRODUCT DETAILS


Series :  958

Item Name :  Soldering Flux

UNSPSC :  23271808

Boards are dry and cosmetically clean as they exit the wave solder machine, thus posing no interference with electrical testing. 958 has excellent compatibility with most conformal coating products on the market today. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue.


产品详情


系列：958

商品名称：焊剂

UNSPSC：23271808

当焊盘离开波峰焊机时，它们是干燥且美观的，因此不会干扰电气测试。958与目前市场上大多数保形涂料产品具有出色的相容性。这种综合配方具有改善的润湿特性，并且还具有优异的腐蚀抑制性能，并提供非粘性残留物。



SPECS



Design & Construction
Form Liquid 
Color Clear 
Flux Type No-Clean 
Performance Details
Vapor Pressure 43  hPa
General Features
Shelf Life 36 Months 
Storage Temperature 10 to 25 deg C 
Environmental Condition
Temperature Rating 90  deg C
Chemical Properties
Chemical Composition Isopropanol, Bis(2-Butoxyethyl) Ether, Proprietary Carboxylic Acid, Aliphatic Ketone, Water 
Flux Formula 958 
Specific Gravity 0.806 
Supporting Information
RoHS Info 2015/863 Directive 
Flux Designator ORL0 
Physical Properties
Odor/Scent Mild 


眼镜



设计与施工
形成 液体 
颜色 明确 
助焊剂类型 免洗 
表现详情
蒸汽压力 43 hPa
一般特征
保质期 36个月 
贮存温度 10至25摄氏度 
环境条件
温度等级 90摄氏度
化学性质
化学成分 异丙醇，双（2-丁氧基乙基）醚，专有羧酸，脂肪酮，水 
助焊剂配方 958 
比重 0.806 
支持信息
RoHS信息 2015/863指令 
Flux指示器 ORL0 
物理特性
气味/香味 温和 




FEATURES & APPLICATIONS


Features :



  • Excellent for bare copper circuit board technology
  • Compatible with conformal coat processes
  • Improves soldering performance
  • Reduced odor associated with soldering process
  • Eliminates the need and expense of cleaning
  • Non-corrosive tack-free residues
  • Temperature rating of 90 to 105 deg C
  • Vapor pressure of 43 hPa at 20 deg C



功能和应用


特点：



  • 非常适合裸铜电路板技术
  • 与保形涂层工艺兼容
  • 提高焊接性能
  • 减少与焊接过程相关的气味
  • 消除了清洁的需要和费用
  • 无腐蚀性无粘性残留物
  • 温度额定值为90至105摄氏度
  • 蒸气压在20℃时为43hPa


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