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  • 产品名称：Soder-Wick® Unfluxed Desoldering Braid Soder-Wick®未熔化的脱焊编织物

  • 产品型号：70-2-25
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
Soder-Wick, significantly reduces rework/repair time and minimizes the risk of heat damage to the board. Its geometrically precise weave design allows for maximum capillary action and solder capacity. Soder-Wick desoldering braid optimizes heat transfer through the braid and into the solder joint, resulting in faster wicking action than any othe 一步编织是免清洗，快速和可靠的。板上的助焊剂残留物不需要清洁。与使用RMA型免清洗助焊剂的工艺配合使用
详情介绍：

PRODUCT DETAILS


Trade Name :  Soder-Wick®

Series :  70

Item Name :  Desoldering Braid

UNSPSC :  23271803

Soder-Wick desoldering braid is available in the most comprehensive variety of widths, lengths and flux types. Application-specific sizes allow for precision solder removal in a flash. Sealed in Performance Pak™ barrier Packaging and VacuPak™ vacuum sealed packaging, Soder-Wick desoldering braid is completely protected from the harmful effects of the environment.


产品详情


商品名称：Soder-Wick®

系列：70

商品名称：脱焊辫子

UNSPSC：23271803

Soder-Wick脱焊编织带有的宽度，长度和助焊剂类型。特定应用的尺寸允许在闪光灯中**去除焊料。采用Performance Pak™阻隔包装和VacuPak™真空密封包装，Soder-Wick脱焊编织物完全免受环境的有害影响。



SPECS



Design & Construction
Flux Type Unfluxed 
Material Copper 
General Features
Shelf Life 24 Months 


眼镜



设计与施工
助焊剂类型 Unfluxed 
材料 铜 
一般特征
保质期 24个月 




FEATURES & APPLICATIONS


Features :



  • Can be coated with any flux type
  • Allows for a constant flux type throughout the production process
  • Provides quick and safe desoldering


Applications :



  • For Through-Hole Components, Surface Mount Device Pads, BGA Pads, Micro Circuits, Terminals, Lugs and Posts and Identification Script



功能和应用


特点：



  • 可涂任何助焊剂类型
  • 在整个生产过程中允许恒定的助焊剂类型
  • 提供快速**的拆焊


应用：



  • 用于通孔元件，表面贴装器件焊盘，BGA焊盘，微电路，端子，接线片和接杆以及识别脚本



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