40 Soder-Wick® No-Clean Desoldering Braid 40 Soder-Wick®免清洗脱焊编织物 40-1-5 峰源隆国际贸易（上海）有限公司

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产品名称：40 Soder-Wick® No-Clean Desoldering Braid 40 Soder-Wick®免清洗脱焊编织物
产品型号：40-1-5
产品厂商：美国EIS
产品文档：

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简单介绍：

Soder-Wick lead-free is the state of the art in desoldering technology. It is specially designed for removal of today's high temperature lead-free solders. The single layer weave used for Soder-Wick lead free braid is lighter in mass than any other desoldering braid available and allows for lead-fr Soder-Wick无铅是脱焊技术的新技术。它专为去除当今的高温无铅焊料而设计。用于Soder-Wick无铅编织层的单层编织物质比任何其他可用的脱焊编织物质量更轻，并且允许在较低温度下去除无铅焊料

详情介绍：

PRODUCT DETAILS

Trade Name : Soder-Wick®

Series : 40

Item Name : Desoldering Braid

UNSPSC : 23271803

Soder-Wicklead-free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less "contact" time thus preventing heat damage to the PCB and sensitive components.

产品详情

商品名称：Soder-Wick®

系列：40

商品名称：脱焊辫子

简短描述：DESOLDERING-BRAID，.035“WIDE 5'YEL

包装：25 SD梭芯/外壳

UPC：032599098847

UNSPSC：23271803

Soder-Wicklead的响应速度比任何其他传统的拆焊辫子都要快。这种独特的设计可大限度地减少过热，并且需要较少的“接触”时间，从而防止对PCB和敏感元件造成热损坏。

SPECS

Design & Construction

Flux Type	No-Clean
Material	Copper

General Features

Shelf Life	24 Months
Type	Lead Free

眼镜

设计与施工

颜色	黄色
助焊剂类型	免洗
材料	铜

一般特征

保质期	24个月
类型	无铅

物理特性

长度	5英尺
宽度	0.03英寸

FEATURES & APPLICATIONS

Features :

Engineered specifically for high temperature, lead-free solders
Transfers heat to the solder joint more quickly and efficiently than conventional desoldering braids
Specifically designed for all lead-free solders
Can also be used with tin/lead solders
Soder-Wick lead-free packaged in ESD safe static dissipative bobbins
Minimizes the risk of damage associated with static electricity
Non-corrosive ultra high purity no-clean flux
Will not leave ionic contamination on the boards
Especially effective at removing residual solder from SMT pads
Fastest wicking and heat transfer
High capacity for solder uptake
Halide-free, no-corrosive residues
Minimizes risk of heat damage to pads, components and PCB