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  • 产品名称：60 Soder-Wick® No-Clean ESD Desoldering Braid 60 Soder-Wick®免清洗ESD拆焊辫子

  • 产品型号：60-1-10
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
Soder-Wick no-clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick no-clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick免清洗设计用于提供快速**的脱焊，而不会留下有害的助焊剂残留物。Soder-Wick免清洗采用纯净无氧铜编织和**助焊剂技术，制造出高效，有效的脱焊编织层。
详情介绍：

PRODUCT DETAILS


Trade Name :  Soder-Wick®

Series :  60

Item Name :  Desoldering Braid

UNSPSC :  23271803

Soder-Wick no-clean SD is available on ESD safe bobbins for protection against damage due to static electricity. Minimizes the risk of damage associated with static electricity. Patented non-corrosive, halide-free, organic no-clean flux.


产品详情


商品名称：Soder-Wick®

系列：60

商品名称：脱焊辫子

UNSPSC：23271803

Soder-Wick免清洗SD可用于ESD**线轴，以防止静电损坏。大限度地降低与静电相关的损坏风险。**的非腐蚀性，无卤化物，有机免清洗助焊剂。



SPECS



Design & Construction
Flux Type No-Clean 
Material Copper 
General Features
Shelf Life 24 Months 


眼镜



设计与施工
助焊剂类型 免洗 
材料 铜 
一般特征
保质期 24个月 




FEATURES & APPLICATIONS


Features :



  • Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
  • Requires little or no post solder cleaning
  • Non-corrosive residues
  • Halide free
  • Minimal risk of heat and static component damage


Applications :



  • For Lugs and Posts, Micro Circuits, Surface Mount Device Pads and Ball Grid Array Pads



功能和应用


特点：



  • 脱焊剂比竞争对手的免清洗辫子快40％，并使板材更清洁
  • 需要很少或不需要焊后清洁
  • 非腐蚀性残留物
  • 无卤化物
  • 小的热量和静电元件损坏风险


应用：



  • 适用于接线片和接线柱，微电路，表面贴装器件焊盘和球栅阵列焊盘



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