产品详情
  • 产品名称:Sn Pb Desolder Wire 锡铅焊锡丝

  • 产品型号:LMS-0975
  • 产品厂商:美国EIS
  • 产品文档:
你添加了1件商品 查看购物车
简单介绍:
Low Temperature SMD and through hole removal and BGA pad re-dressing solder. 低温SMD和通孔去除和BGA焊盘重新修整焊料。
详情介绍:
  • Brand name :  Zephyrtronics
  • Trade Name :  LOWMELT®
  • Item Name :  Desolder Wire
  • Short Desc :  LOWMELT DE-SOLDER WIRE 32 FT
  • UNSPSC :  23271800

LowMelt allows rapid SMD and Thru-Hole removal through the decades-old process of solder Co-Metallization with either a just pre-heater placed below the PCB or with a simple soldering iron or with any heated desoldering tool or, yes, even under a hot air nozzle. Every lab and rework bench should have a tube of LowMelt at the technician's fingertips when needed. Our customers believe it's that essential.

品牌名称:Zephyrtronics
商品名称:LOWMELT®
商品名称:Desolder Wire
简短说明:LOWMELT DE-SOLDER WIRE 32 FT
UNSPSC:23271800
LowMelt通过几十年历史的焊接共金属化工艺,可以快速去除SMD和通孔,只需将预热器放置在PCB下方或使用简单的烙铁或任何加热的拆焊工具,或者即使在 热风喷嘴。 每个实验室和返工工作台在需要时都应该在技术人员的指尖处使用LowMelt管。 我们的客户认为这是至关重要的。

Environmental Condition
Melting Range 302  deg F
Physical Properties
Alloy Sn Pb 
环境条件
熔化范围302华氏度
物理特性
合金Sn Pb

Features :

  • Prevents burning, warping PCB's in rework
  • Prevents lifting pads during rework
  • No need for nozzles to remove SMD's
  • Remove through hole chips and connectors easier
  • Prevents high temperature damage to IC's and caps
  • Eliminates sticky desolder wick with BGA's
  • De-clogs your desoldering tools quickly
  • Redress weak BGA pads without wick/braid
  • 32 ft length wire
特征 :

防止在返工时烧毁,翘曲PCB
在返工期间防止提升垫
不需要喷嘴去除SMD
更容易移除通孔芯片和连接器
防止IC和电容器的高温损坏
用BGA消除粘性脱焊剂灯芯
快速堵塞您的拆焊工具
在没有灯芯/编织物的情况下修复弱BGA衬垫
32英尺长的电线


沪公网安备 31010902002433号