EM828-SAC305-89.5 Lead-Free Solder Paste EM828-SAC305-89.5无铅焊膏 SN96.5EM828-600GT4 桑戈国际贸易（上海）有限公司

产品详情

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产品名称：EM828-SAC305-89.5 Lead-Free Solder Paste EM828-SAC305-89.5无铅焊膏
产品型号：SN96.5EM828-600GT4
产品厂商：美国EIS
产品文档：

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简单介绍：

The EM828 is a lead-free, water soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products.

详情介绍：

PRODUCT DETAILS

Series : EM828-SAC305-89.5

Item Name : Lead-Free Solder Paste

UNSPSC : 23271816

Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.

产品详情

系列：EM828-SAC305-89.5

商品名称：无铅焊膏

UNSPSC：23271816

此外，无论打印速度，空闲时间和吞吐量如何，EM828在模板印刷过程中都非常稳定。EM828为各种电路板和元件表面处理提供了大的润湿性，从而简化了向无铅工艺的过渡。

SPECS

Design & Construction

Form	Paste
Applicable Materials	Stainless Steel, Molybdenum, Nickel Plated or Brass
Color	Silver Gray
Flux Type	Organic Activated or Water Soluble

General Features

Shelf Life	6 Months
Type	Lead-Free
Storage Temperature	0 to 10 deg C

Environmental Condition

Melting Range	217 deg C
Temperature Rating	21 deg C

Chemical Properties

Flux Formula	EM828
Mesh Size	-325/+500

Supporting Information

RoHS Info	2011/65/EU Directive
Flux Designator	ORH1

Physical Properties

Alloy	Sn96.5 Ag3.0 Cu0.5 (SAC305)
Odor/Scent	Mild

眼镜

设计与施工

形成	糊
适用材料	不锈钢，钼，镀镍或黄铜
颜色	银灰
助焊剂类型	有机活性或水溶性

一般特征

保质期	6个月
类型	无铅
贮存温度	0到10摄氏度

环境条件

熔化范围	217摄氏度
温度等级	21摄氏度

化学性质

助焊剂配方	EM828
网格尺寸	-325 / + 500

支持信息

RoHS信息	2011/65 / EU指令
Flux指示器	ORH1

物理特性

合金	Sn96.5 Ag3.0 Cu0.5（SAC305）
气味/香味	温和

FEATURES & APPLICATIONS

Features :

Capable of breaks in printing of up to 60 min without any kneading
Contains halogen
Excellent wetting on a variety of metallizations
Long stencil and tack life (process dependent)
Low voiding underneath area array components
Print speed up to 150 mm/sec (6 Inch/sec)
Residues easily removed with hot DI water
Tremendous brick definition and slump resistance for reduction of bridging defects
Metals percentage of 89.5%
Melting range of 217 to 218 deg C
Temperature rating of 21 to 25 deg C