产品详情
  • 产品名称:920-CXF No-Clean Soldering Flux 920-CXF免清洗焊剂

  • 产品型号:KES920CXFG
  • 产品厂商:美国EIS
  • 产品文档:
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简单介绍:
The 20-CXF is a zero halogen, low solids, no-clean organic flux designed for wave soldering conventional and surface mount circuit board assemblies. This flux eliminates defects often experienced in surface mount assembly wave soldering operations with trad 920-CXF是一种零卤素,低固含量,免清洗有机助焊剂,专为波峰焊接传统和表面贴装电路板组件而设计。这种助焊剂消除了传统助焊剂表面贴装组装波峰焊接操作中经常遇到的缺陷。这种非腐蚀性和非导电性焊剂具有*低的固含量。焊接后组件上基本上没有残留物。没有残留物干扰电气测试并且消除了清洁费用
详情介绍:

PRODUCT DETAILS


Series :  920-CXF

Item Name :  Soldering Flux

Short Desc :  FLUX,920-CXF,SM 1GL

UNSPSC :  23271808

PCB assemblies are dry as they exit the wave solder machine. The surface insulation resistance is higher than that provided by typical organic water soluble fluxes. Electrical reliability of the assembly is assured. This flux formulation is suitable for soldering bare copper and solder plated circuit boards. It is advised that bare copper boards be free of excessive oxides and other contamination for optimum soldering performance.


产品详情


系列:920-CXF

商品名称:焊剂

简短说明:FLUX,920-CXF,SM 1GL

UNSPSC:23271808

PCB组件在离开波峰焊机时是干燥的。表面绝缘电阻高于典型的有机水溶性助焊剂。确保组件的电气可靠性。该助焊剂配方适用于焊接裸铜和镀锡电路板。建议裸铜板不含过多的氧化物和其他污染物,以获得*佳的焊接性能。



SPECS



Design & Construction
Form Liquid 
Color Light Yellow 
Flux Type No-Clean 
Performance Details
Vapor Pressure 43  hPa
General Features
Shelf Life 12 Months 
Storage Temperature 10 to 25 deg C 
Environmental Condition
Temperature Rating 82  deg C
Chemical Properties
VOC 753  g/L
Chemical Composition Isopropanol, Adipic acid, Rosin Modified, 2-Phenoxyethanol 
Flux Formula 920-CXF 
Specific Gravity 0.8 
Supporting Information
RoHS Info 2015/863 Directive 
Flux Designator ORL0 
Physical Properties
Container Size 1  gal
Container Type Bottle 
Odor/Scent Alcohol 


眼镜



设计与施工
形成 液体 
颜色 淡黄色 
助焊剂类型 免洗 
表现详情
蒸汽压力 43 hPa
一般特征
保质期 12个月 
贮存温度 10至25摄氏度 
环境条件
温度等级 82摄氏度
化学性质
VOC 753克/升
化学成分 异丙醇,己二酸,松香改性,2-苯氧基乙醇 
助焊剂配方 920-CXF 
比重 0.8 
支持信息
RoHS信息 2015/863指令 
Flux指示器 ORL0 
物理特性
集装箱尺寸 1加仑
集装箱类型 瓶子 
气味/香味 醇 




FEATURES & APPLICATIONS


Features :



  • Essentially no residue left behind after soldering
  • Eliminates expense of cleaning
  • Boards are dry as they exit the wave solder machine
  • Non-corrosive and halogen-free
  • No surface insulation resistance degradation
  • No offensive odors given off during soldering
  • Temperature rating of 82 to 110 deg C
  • Vapor pressure of 43 hPa at 20 deg C



功能和应用


特点:



  • 接后基本上没有留下任何残留物
  • 消除清洁费用
  • 当焊盘离开波峰焊机时,它们是干燥的
  • 无腐蚀性和无卤素
  • 无表面绝缘电阻降低
  • 在焊接过程中不会散发令人不快的气味
  • 温度额定值为82至110摄氏度
  • 蒸气压在20℃时为43hPa


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