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  • 产品名称：2235 Organic Activated Soldering Flux 2235有机活性焊剂

  • 产品型号：KES223553G
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
The 2235 is a high activity 11% solids organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. 2235, a flux with comparably low solids in respect to other fluxes in the same category, 2235是一种高活性11％固体有机助焊剂，设计用于需要更具侵蚀性的助焊剂的电路板组件的自动焊接，但可靠性考虑是至关重要的。2235，相对于同一类别中的其他焊剂具有相对低固体含量的焊剂将在底侧表面安装焊盘上产生较少的跳跃
详情介绍：

PRODUCT DETAILS


Series :  2235

Item Name :  Soldering Flux

UNSPSC :  23271808

The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. No offensive odors or excessive smoke are emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.


产品详情


系列：2235

商品名称：焊剂

UNSPSC：23271808

焊接后的残留物可在标准水清洗系统中有效去除。虽然具有高活性，但是在水清洗后，板表现出高离子清洁度，*过MIL-P-28809的要求。焊接过程中不会散发令人不快的气味或过多的烟雾。助焊剂不会在标准水清洁系统中产生过多的泡沫。



SPECS



Design & Construction
Form Liquid 
Color Light Yellow 
Flux Type Organic Activated or Water Soluble 
Performance Details
Vapor Pressure 43  hPa
General Features
Shelf Life 24 Months 
Storage Temperature 10 to 25 deg C 
Environmental Condition
Temperature Rating 54  deg C
Chemical Properties
VOC 763  g/L
Chemical Composition Isopropanol, Glycolic Acid, Guanidinium Chloride, Glycerol, Water 
Flux Formula 2235 
Specific Gravity 0.856 
Supporting Information
RoHS Info 2011/65/EU Directive 
Flux Designator ORH1 
Physical Properties
Odor/Scent Alcohol 


眼镜



设计与施工
形成 液体 
颜色 淡黄色 
助焊剂类型 有机活性或水溶性 
表现详情
蒸汽压力 43 hPa
一般特征
保质期 24个月 
贮存温度 10至25摄氏度 
环境条件
温度等级 54摄氏度
化学性质
VOC 763克/升
化学成分 异丙醇，乙醇酸，氯化胍，甘油，水 
助焊剂配方 2235 
比重 0.856 
支持信息
RoHS信息 2011/65 / EU指令 
Flux指示器 ORH1 
物理特性
气味/香味 醇 




FEATURES & APPLICATIONS


Features :



  • High activity
  • Minimizes icicling and bridging
  • Chemically compatible with most solder masks and board laminates
  • High ionic cleanliness and no surface insulation resistance degradation
  • Excellent choice for surface mount boards
  • Temperature rating of 54 to 66 deg C
  • Vapor pressure of 43 hPa at 20 deg C



功能和应用


特点：



  • 活动量很大
  • 大限度地减少icicling和桥接
  • 与大多数焊接掩模和板层压板在化学上兼容
  • 离子清洁度高，无表面绝缘电阻降低
  • 表面贴装板的佳选择
  • 温度额定值为54至66摄氏度
  • 蒸气压在20℃时为43hPa


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