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PRODUCT DETAILS
Item Name : Lead Free Bar Solder
Short Desc : 99.3/NT100GE,BAR SOLDER,2.2 LB
UNSPSC : 23271815
Produced using the same chemical composition as the solder alloy marketed as SN100C� by Nihon Superior Sha Co.,Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements.� With a melting temperature of 441�F, NT100Ge is compatible with all wave and selective solder equipment. Similar to the effect of phosphorous in Sn63 alloys, the small addition of Germanium in NT100Ge serves as a de-oxidant, which keeps drossing to a minimum.� For PCB fabrication applications such as the hot air solder leveling (HASL) process during which copper levels increase, NT100GeX provides a low-copper solder solution. NT100Ge can be used as a drop-in replacement for any existing 99C or SN100C solder bath, without the need for pot dumps or swaps. Once NT100Ge is in use, offers free, unlimited solder analysis to help maintain J-STD specifications and an optimal soldering process.
产品详情
商品名称:无铅棒焊料
简短描述:99.3 / NT100GE,BAR SOLDER,2.2 LB.
UNSPSC : 23271815
使用与Nihon Superior Sha Co.,Ltd。以SN100C 销售的焊料合金相同的化学组成制造。及其授权商,NT100Ge是一种高品质,低成本的含银焊料替代品。共晶锡铜镍合金可为各种电子组装要求创造光亮,光滑,坚固的互连. NT100Ge的熔化温度为441 F,可与所有波峰和选择性焊接设备兼容。类似于Sn63合金中磷的影响,NT100Ge中少量添加锗作为脱氧剂,可将渣滓降至低. 用于PCB制造应用,如热风焊料平整(HASL)工艺,其中铜水平提高,NT100GeX提供低铜焊料解决方案。NT100Ge可用作任何现有99C或SN100C焊料槽的直接替代品,无需罐式转储或交换。一旦使用NT100Ge,可提供免费的无限量焊料分析,以帮助维持J-STD规格和佳焊接工艺。
FEATURES & APPLICATIONS
Features :
- Consistently smooth and shiny solder joint
- Low-cost, lead-free solder alloy (no silver content)
- Superior wetting and performance
- Minimal dross
- Eutectic properties create efficient melting and freezing
- Operating temperature of 290�C - 320�C, similar to other lead-free solders
功能和应用
特点:
- 始终如一的光滑和光亮的焊点
- 低成本,无铅焊料合金(无银含量)
- 的润湿性和性能
- 小的渣滓
- 共晶特性可实现高效的熔化和冷冻
- 工作温度为290 C - 320 C,与其他无铅焊料相似