产品详情
  • 产品名称:495740050 Ultrapure® Lead-Free Bar Solder 495740050Ultrapure®无铅棒焊锡

  • 产品型号:SN99.3ULTRAPURE
  • 产品厂商:美国EIS
  • 产品文档:
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简单介绍:
K100LD is a eutectic tin/copper alloy with controlled metallic dopants to control the grain structure within the solder joint and to minimize the dissolution of copper into the solder pot. K100LD是一种共晶锡/铜合金,具有受控金属掺杂剂,可控制焊点内的晶粒结构,并大限度地减少铜在焊锡锅中的溶解。
详情介绍:

PRODUCT DETAILS


Trade Name :  Ultrapure®

Series :  K100LD

Item Name :  Bar Solder

Short Desc :  99.3/K100LD ULTRAPURE BAR 1-2/3 LB

Packaging :  15 Bars/Case

UNSPSC :  23271815

K100LD virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.


产品详情


商品名称:Ultrapure®

系列:K100LD

商品名称:Bar Solder

简短说明:99.3 / K100LD ULTRAPURE BAR 1-2 / 3 LB.

包装:15条/箱

UNSPSC:23271815

K100LD几乎消除了诸如冰雹和桥接等常见缺陷的发生。与传统的无铅合金替代品相比,改进的晶粒结构也使焊点更光亮。



SPECS



Design & Construction
Form Solid 
Finish Silver Gray 
General Features
Type Lead-Free 
Net Weight 25 lb 
Environmental Condition
Melting Range 221  deg C
Physical Properties
Alloy Sn99.3 Cu0.7 (K100LD) 
Weight 1.66  lb


眼镜



设计与施工
形成 固体 
银灰 
一般特征
类型 无铅 
净重 25磅 
环境条件
熔化范围 221摄氏度
物理特性
合金 Sn99.3 Cu0.7(K100LD) 
重量 1.66磅




FEATURES & APPLICATIONS


Features :



  • 20% Lower dross rate than Sn63Pb37 in laboratory tests
  • Bright, smooth solder joints with no visible shrinkage effects
  • Eutectic alloy
  • Excellent through hole penetration and topside fillet
  • Less corrosive to solder pots than SAC305
  • Low cost, lead-free alloy
  • Low dissolution of copper from boards and components into solder pot
  • Contains halogen
  • Melting range of 221 to 245 deg C


Applications :



  • For Wave, Selective and Dip Tinning Operations



功能和应用


特点:



  • 实验室测试中,比Sn63Pb37降低20%的浮渣率
  • 明亮,光滑的焊点,没有明显的收缩效应
  • 共晶合金
  • 优良的通孔穿透和顶部圆角
  • 比SAC305对焊锡锅的腐蚀性更小
  • 低成本,无铅合金
  • 铜从板和元件溶解到焊锡锅中的溶解度很低
  • 含有卤素
  • 熔化范围为221至245摄氏度


应用:



  • 适用于波浪,选择性和浸镀操作


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