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  • 产品名称：952-D6 No-Clean Flux Pen 952-D6免清洗助焊剂笔

  • 产品型号：952-D6-FLUXPEN
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
The 952-D6 flux pen is a no-clean, non-corrosive, halide-free flux pen that is specifically designed for lead-free rework of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering. A major advantage of this flux is the reduced odor associ 952-D6助焊笔是一种免清洗，无腐蚀性，无卤素的助焊笔，专为传统和表面贴装电路板组件的无铅返修而设计。焊接后基本上没有残留物残留。该助焊剂的主要优点是减少了与焊接过程相关的气味。952-D6含有少量松香，具有更高的可靠性
详情介绍：

PRODUCT DETAILS


Series :  952-D6

Item Name :  Flux Pen

Short Desc :  FLUX-PEN,952-D6 NO CLEAN 1/3 OZ

UNSPSC :  23271800

952-D6 was developed with a modified surface tension to aid in soldering boards that have surface mount and high component densities. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue.


产品详情


系列：952-D6

商品名称：Flux Pen

简短描述：FLUX-PEN，952-D6 NO CLEAN 1/3 OZ

UNSPSC：23271800

952-D6的开发具有改进的表面张力，有助于焊接具有表面贴装和高元件密度的电路板。这种综合配方具有改善的润湿特性，并且还具有优异的腐蚀抑制性能，并提供非粘性残留物。



SPECS



Design & Construction
Form Liquid 
Flux Type No-Clean 
Performance Details
Vapor Density 0.81  g/cc
Vapor Pressure 59  hPa
General Features
Shelf Life 24 Months 
Storage Temperature 10 to 25 deg C 
Chemical Properties
Chemical Composition Isopropanol, Ethanol, n-Butyl Acetate, Methanol, Dimethyl Adipate, Adipic Acid, Modified Rosin 
Flux Formula 952 
Supporting Information
RoHS Info 2011/65/EU Directive 
Flux Designator ORL0 
Physical Properties
Container Size 0.33  oz
Odor/Scent Alcohol 


眼镜



设计与施工
形成 液体 
助焊剂类型 免洗 
表现详情
蒸气密度 0.81克/立方厘米
蒸汽压力 59 hPa
一般特征
保质期 24个月 
贮存温度 10至25摄氏度 
化学性质
化学成分 异丙醇，乙醇，乙酸正丁酯，甲醇，己二酸二甲酯，己二酸，改性松香 
助焊剂配方 952 
支持信息
RoHS信息 2011/65 / EU指令 
Flux指示器 ORL0 
物理特性
集装箱尺寸 0.33盎司
气味/香味 醇 




FEATURES & APPLICATIONS


Features :



  • Residues are almost colorless
  • Improves soldering performance
  • Reduced odor associated with soldering process
  • Eliminates the need and expense of cleaning
  • Non-corrosive tack-free residues
  • Contains <0.5% rosin
  • Vapor density of 0.81 g/cc at 20 deg C
  • Vapor pressure of 59 hPa at 20 deg C


Applications :



  • For Rework of Conventional and Surface Mount Circuit Board Assemblies



功能和应用


特点：



  • 残留物几乎无色
  • 提高焊接性能
  • 减少与焊接过程相关的气味
  • 消除了清洁的需要和费用
  • 无腐蚀性无粘性残留物
  • 含有<0.5％松香
  • 蒸气密度在20℃下为0.81g / cc
  • 蒸气压在20℃时为59hPa


应用：



  • 用于传统和表面贴装电路板组件的返工



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