产品名称：Substratek™TEM金属基板

Important properties of the ultrathin Substratek™
Metallic Support Films are:
Electron transparent with a 2-3nm thickness
Small feature sizes do not obscure sample features
Chemically stable (can be used for electroplating)
Robust enough to act as substrates
High surface energy.
They are ideally suited for use as integrated research
platforms for applications as diverse as:
Nanofabrication
Electron-beam lithography
Micro-contact printing
Electrochemistry or electroplating
Nano-crystal growth
Carbon nano tubes
X-ray analysis of carbon containing materials
Surface and interface science

The Substratek™ TEM Substrates are metallic ultrathin films on a standard 3mm TEM grid. Available substrate are Au, Pt, Pd (2-3nm thickness) and TiOx (10-20nm thickness) on 300 and 400mesh TEM grids. The Au, Pt and Pd substrates are deposited on gold TEM grids compatible with electrochemical processes. The TiOx substrate is deposited on copper TEM grids; These materials have proven to be stable substrates with a small feature size in the support film. The TiOx substrate is more bio-compatible and can also be used for life-science applications. They are supplied in a PELCO® 160 TEM grid box in quantities of 25 per box.
G400: Pitch 62µm; Hole Width 37µm; Bar Width 25µm; Transmission 37%
 

Prod #	Description	Unit

21410-25

Substratek™, 2-3nm Pt on 400 mesh Au TEM grid

pkg/25

21420-25

Substratek™, 2-3nm Au on 400 mesh Au TEM grid

pkg/25

21430-25

Substratek™, 2-3nm Pd on 400 mesh Au TEM grid

pkg/25

21440-25

Substratek™, 10-20nm TiOx on 400 mesh Cu TEM grid

pkg/25

TEM substrates on 300 mesh TEM grids
G300: Pitch 83µm; Hole Width 58µm; Bar Width 25µm; Transmission 49%

Prod #	Description	Unit

21310-25

Substratek™, 2-3nm Pt on 300 mesh Au TEM grid

pkg/25

21320-25

Substratek™, 2-3nm Au on 300 mesh Au TEM grid

pkg/25

21330-25

Substratek™, 2-3nm Pd on 300 mesh Au TEM grid

pkg/25

21340-25

Substratek™, 10-20nm TiOx on 300 mesh Cu TEM grid

pkg/25