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PRODUCT DETAILS
Series : HM531-6337-89.5
Item Name : Solder Paste
Short Desc : PASTE, 63/37,HM531,TYPE3,89.5%,600G CRT
UNSPSC : 23271816
The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCBs and PdAg components. The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water soluble solder paste for any application.
产品详情
系列:HM531-6337-89.5
商品名称:焊膏
简短描述:PASTE,63/37,HM531,TYPE3,89.5%,600G CRT
UNSPSC:23271816
HM531中的活化剂包非常具有侵蚀性,可为OSP涂层的PCB和PdAg组分提供润湿性。批次一致性,抗塌落性,一致的印刷量,可焊性和可清洁性使HM531成为适用于任何应用的理想水溶性焊膏。
SPECS
Form | Paste |
Applicable Materials | Stainless Steel, Molybdenum, Nickel Plated or Brass |
Color | Silver Gray |
Flux Type | Organic Activated or Water Soluble |
Particle Type | Type 3 |
Shelf Life | 6 Months |
Storage Temperature | 0 to 10 deg C |
Melting Range | 179 deg C |
Temperature Rating | 21 deg C |
Flux Formula | HM531 |
Mesh Size | -325/+500 |
RoHS Info | 2011/65/EU Directive |
Flux Designator | ORM0 |
Container Size | 600 g |
Container Type | Cartridge |
Alloy | Sn63 Pb37 |
Odor/Scent | Mild |
眼镜
形成 | 糊 |
适用材料 | 不锈钢,钼,镀镍或黄铜 |
颜色 | 银灰 |
助焊剂类型 | 有机活性或水溶性 |
粒子类型 | 输入3 |
保质期 | 6个月 |
贮存温度 | 0到10摄氏度 |
熔化范围 | 179摄氏度 |
温度等级 | 21摄氏度 |
助焊剂配方 | HM531 |
网格尺寸 | -325 / + 500 |
RoHS信息 | 2011/65 / EU指令 |
Flux指示器 | ORM0 |
集装箱尺寸 | 600克 |
集装箱类型 | 盒式磁带 |
合金 | Sn63 Pb37 |
气味/香味 | 温和 |
FEATURES & APPLICATIONS
Features :
- stencil life of 8+ hr
- Capable of 60+ min idle times in printing
- Capable of print speeds up to 150 mm/sec (6 Inch/sec)
- Contains halogen
- Compatible with enclosed print head systems
- Excellent anti-slump characteristics minimizing bridging defects
- Excellent solderability to a wide variety of metallizations, including palladium, leaving bright, shiny joints
- HM531 provides outstanding batch to batch consistency
- Minimal foam in wash systems
- Produces minimal voiding underneath BGA components
- Residues easily removed with hot DI water, even up to 48 hr after soldering
- Metals percentage of 89.5%
- Melting range of 179 to 189 deg C
- Temperature rating of 21 to 25 deg C
Applications :
- For Stencil Printing Applications
功能和应用
特点:
- 模板寿命为8小时以上
- 打印时可以有60多分钟的空闲时间
- 打印速度可达150毫米/秒(6英寸/秒)
- 含有卤素
- 兼容封闭式打印头系统
- 抗塌落特性,大限度地减少桥接缺陷
- 对各种金属化(包括钯)具有可焊性,可留下明亮,有光泽的接缝
- HM531提供批次间一致性
- 洗涤系统中泡沫少
- 在BGA组件下产生小的空洞
- 使用热DI水可轻松去除残留物,甚至在焊接后48小时
- 金属百分比为89.5%
- 熔化范围为179至189摄氏度
- 温度等级为21至25摄氏度
应用:
- 用于模板印刷应用