产品详情
  • 产品名称:R276 Type 3 Solder Paste R276 3型焊膏

  • 产品型号:SN965AG3R276-35G
  • 产品厂商:美国EIS
  • 产品文档:
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简单介绍:
The R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes.
详情介绍:

PRODUCT DETAILS


Series :  R276-SAC305-86

Item Name :  Lead-Free Solder Paste

Short Desc :  PASTE,96.5/AG3/CU.5,R276,TY3,86%,35G SYR

UNSPSC :  23271816

R276 is available in Sn63Pb37 and Sn96.5Ag3.0Cu0.5 alloys. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.


产品详情


系列:R276-SAC305-86

商品名称:无铅焊膏

简短描述:PASTE,96.5 / AG3 / CU.5,R276,TY3,86%,35G SYR

UNSPSC:23271816

R276有Sn63Pb37和Sn96.5Ag3.0Cu0.5合金。R276的流动特性可提供分配特性,并具有多种针头直径。



SPECS



Design & Construction
Form Paste 
Color Silver Gray 
Flux Type No-Clean 
Particle Type Type 3 
General Features
Shelf Life 6 Months 
Type Lead-Free 
Storage Temperature 0 to 10 deg C 
Environmental Condition
Melting Range 183  deg C
Temperature Rating 21  deg C
Chemical Properties
Flux Formula R276 
Mesh Size -325/+500, -400/+500 
Supporting Information
RoHS Info 2011/65/EU Directive 
Flux Designator ROL0 
Physical Properties
Container Size 35  g
Container Type Syringe 
Alloy Sn96.5 Ag3.0 Cu0.5 (SAC305) 
Odor/Scent Mild 


眼镜



设计与施工
形成 糊 
颜色 银灰 
助焊剂类型 免洗 
粒子类型 输入3 
一般特征
保质期 6个月 
类型 无铅 
贮存温度 0到10摄氏度 
环境条件
熔化范围 183摄氏度
温度等级 21摄氏度
化学性质
助焊剂配方 R 276 
网格尺寸 -325 / + 500,-400 / + 500 
支持信息
RoHS信息 2011/65 / EU指令 
Flux指示器 ROL0 
物理特性
集装箱尺寸 35克
集装箱类型 注射器 
合金 Sn96.5 Ag3.0 Cu0.5(SAC305) 
气味/香味 温和 




FEATURES & APPLICATIONS


Features :



  • Available with lead-free alloys
  • Capable of several thousands of dots per hr in high speed automated dispense equipment
  • Contains halogen
  • Compatible with Kester easy profile 256 stenciling solder paste
  • Excellent dispensing characteristics using 22 ga needles and type 3 powder
  • High activity on all substrates, including OSPs
  • Manufactured and packaged void-free to insure the most consistent dispensability available
  • Stable tack over 8+ hr
  • Metals percentage of 86%
  • Temperature rating of 21 to 25 deg C
Applications :
  • For Stencil Printing Applications




功能和应用



  • 点:
  • 可提供无铅合金
  • 在高速自动分配设备中每小时能够有数千个点
  • 含有卤素
  • 兼容Kester easy profile 256模板焊膏
  • 使用22 g针和3型粉末,具有点胶特性
  • 在所有基材上都具有高活性,包括OSP
  • 无空隙制造和包装,以确保可靠的可分配性
  • 稳定的粘性*过8小时
  • 金属百分比为86%
  • 温度等级为21至25摄氏度



应用:



  • 用于模板印刷应用


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