产品名称：R520A-SAC305-89.5 Type 3 Lead-Free Solder Paste R520A-SAC305-89.5 Type 3无铅焊膏

PRODUCT DETAILS

Series :  R520A-SAC305-89.5

Item Name :  Lead-Free Solder Paste

UNSPSC :  23271816

R520A was formulated to release consistently from the stencil for those critical fine pitch applications (0.5 mm/20 mils) with anti-slump characteristics and preferred solder deposit definition. The activator package in this formula is extremely aggressive, providing superior wetting to OSP coated and Immersion Gold over Electroless Nickel (ENIG) boards.

产品详情

系列：R520A-SAC305-89.5

商品名称：无铅焊膏

UNSPSC：23271816

R520A的配方可以从模板中一致地释放出那些具有抗坍落度特性和优选焊料沉积定义的临界细间距应用（0.5 mm / 20 mils）。该配方中的活化剂包具有强的侵蚀性，可为OSP涂层和Immersion Gold提供润湿性，而不是化学镀镍（ENIG）板。

SPECS

眼镜

FEATURES & APPLICATIONS

Features :

• Stable tack life to long stencil life
• Consistent printing over a range of temperatures and humidities
• Excellent wetting onto Ag/Pd leaded components
• Lead-free and water soluble
• Print speed up to 150 mm/sec (6 Inch/sec)
• Reduces scrap due to less paste dry out
• Residues easily removed with hot DI water
• Metals percentage of 89.5%
• Temperature rating of 21 to 25 deg C

Applications :

• For Stencil Printing Applications

功能和应用

特点：

• 稳定的粘着寿命，延长模板寿命
• 在一系列温度和湿度下保持一致的打印
• 对Ag / Pd含铅组件具有润湿性
• 无铅和水溶性
• 打印速度高达150毫米/秒（6英寸/秒）
• 由于较少的糊状物干燥而减少了废料
• 使用热DI水轻易去除残留物
• 金属百分比为89.5％
• 温度等级为21至25摄氏度

应用：

• 用于模板印刷应用