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  • 产品名称：NXG1-SAC305-88.5 Type 3 Lead-Free Solder Paste NXG1-SAC305-88.5 Type 3无铅焊膏

  • 产品型号：SN965AG3NXG1-500G
  • 产品厂商：美国EIS
  • 产品文档：
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简单介绍：
The NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with Sn-Pb alloys.
详情介绍：

PRODUCT DETAILS


Series :  NXG1-SAC305-88.5

Item Name :  Lead-Free Solder Paste

UNSPSC :  23271816

NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.


产品详情


系列：NXG1-SAC305-88.5

商品名称：无铅焊膏

UNSPSC：23271816

NXG1还在回流焊点中提供外观，具有光滑，有光泽的焊料和浅色残留物。该浆料还具有8个月内同类产品中长的保质期。NXG1符合ANSI / J-SDTD-005标准。根据IPC ANSI / J-STD-004B的通量被分类为ROL1。



SPECS



Design & Construction
Form Paste 
Applicable Materials Stainless Steel, Molybdenum, Nickel Plated or Brass 
Color Silver Gray 
Flux Type No-Clean 
Particle Type Type 3 
General Features
Shelf Life 8 Months 
Type Lead-Free 
Storage Temperature 0 to 10 deg C 
Environmental Condition
Melting Range 217  deg C
Temperature Rating 21  deg C
Chemical Properties
Flux Formula NXG1 
Mesh Size -325/+500 
Supporting Information
RoHS Info 2011/65/EU Directive 
Flux Designator ROL1 
Physical Properties
Alloy Sn96.5 Ag3.0 Cu0.5 (SAC305) 
Odor/Scent Mild 


眼镜



设计与施工
形成 糊 
适用材料 不锈钢，钼，镀镍或黄铜 
颜色 银灰 
助焊剂类型 免洗 
粒子类型 输入3 
一般特征
保质期 8个月 
类型 无铅 
贮存温度 0到10摄氏度 
环境条件
熔化范围 217摄氏度
温度等级 21摄氏度
化学性质
助焊剂配方 NXG1 
网格尺寸 -325 / + 500 
支持信息
RoHS信息 2011/65 / EU指令 
Flux指示器 ROL1 
物理特性
合金 Sn96.5 Ag3.0 Cu0.5（SAC305） 
气味/香味 温和 




FEATURES & APPLICATIONS


Features :



  • Capable of 120 min break times in printing
  • Capable of print speeds up to 200 mm/sec (8 Inch/sec)
  • Clean cosmetic aesthetics after reflow
  • Excellent printing characteristics on 0.4 mm (16 Mil) pitch QFPs
  • Excellent release from stencil
  • Excellent wetting to a variety of metals
  • Long stencil and tack life (process dependent)
  • Longest shelf life at 8 months
  • Low voiding behavior
  • Reflowable in air and nitrogen
  • Resistant to slump
  • Contains halogen
  • Metals percentage of 88.5%
  • Melting range of 217 to 218 deg C
  • Temperature rating of 21 to 25 deg C


Applications :



  • For Stencil Printing Applications



功能和应用


特点：



  • 印刷时间为120分钟
  • 打印速度可达200毫米/秒（8英寸/秒）
  • 回流后清洁化妆品美观
  • 0.4毫米（16密耳）间距QFP具有印刷特性
  • 模板的释放
  • 对各种金属具有润湿性
  • 长模板和粘性寿命（取决于工艺）
  • 长保质期为8个月
  • 低排尿行为
  • 可在空气和氮气中回流
  • 抵抗衰退
  • 含有卤素
  • 金属百分比为88.5％
  • 熔化范围为217至218摄氏度
  • 温度等级为21至25摄氏度


应用：



  • 用于模板印刷应用


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