产品详情
  • 产品名称:Cho-Bond® Two-Part Conductive Adhesive Cho-Bond®双组分导电胶

  • 产品型号:CHOBOND058415
  • 产品厂商:美国EIS
  • 产品文档:
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简单介绍:
Cho-Bond 584-29 is a two-component, silver filled conductive epoxy adhesive system designed for applications where a strong, highly conductive electrical bond must be achieved. Cho-Bond 584-29是一种双组分,银填充导电环氧粘合剂系统,设计用于必须实现强大,高导电性的电气连接的应用。Cho-Bond 584-29**用于相对较小的粘合线(小于0.010英寸(0.25 mm)),但在振动或可能产生裂纹的应用中可用于较大的粘合线。
详情介绍:


PRODUCT DETAILS


Trade Name :  Cho-Bond®

Item Name :  Conductive Adhesive

Short Desc :  50-02-0584-0029 CHOBOND 2.5-GM PKG

Packaging :  200/Carton

UNSPSC :  31201600

The fine silver filler of Cho-Bond 584-29 make it a good material choice for precise application in and around tight spaces and electrical components. Cho-Bond 584-29 comes in a variety of sizes and packaging so customers can choose a package and material size which is right for their application, minimizing material scrap and mixing issues.


产品详情


商品名:Cho-Bond®

商品名称:导电胶

简短说明:50-02-0584-0029 CHOBOND 2.5-GM PKG

包装:200 /箱

UNSPSC:31201600

Cho-Bond 584-29的精细银填料使其成为在狭小空间和电气元件中及其周围应用的理想材料选择。Cho-Bond 584-29有各种尺寸和包装,因此客户可以选择适合其应用的包装和材料尺寸,大限度地减少材料废料和混合问题。



SPECS



Performance Details
Full Cure Time 24 hr 
Shear Strength 1200 psi 
Design & Construction
Form Paste 
Color Silver Gray 
Cure Type Room Temperature 
Environmental Condition
Temperature Rating -65 to 257 deg F 
Chemical Properties
Composition Epoxy 
Specific Gravity
Physical Properties
Container Size 2.5g 
Container Type Pack 
Hardness 80 Shore D 



眼镜



表现详情
完全固化时间 24小时 
剪切强度 1200 psi 
设计与施工
形成 糊 
颜色 银灰 
类型 室内温度 
环境条件
温度等级 -65至257华氏度 
化学性质
组成 环氧 
比重
物理特性
集装箱尺寸 2.5克 
集装箱类型 包 
硬度 80 Shore D. 




FEATURES & APPLICATIONS


Features :



  • Fast heat cure, increases throughput and minimizes equipment downtime
  • Silver filler
  • Excellent conductivity 0.002 ohm-cm
  • 30 min working life, works well over wide temperature range, good chemical resistance, >1200 psi lap shear, good for permanently bonding surfaces
  • Multiple packaging options
  • No weighing required, mix and dispense in same package, minimizes process scrap
  • Thin paste
  • May be dispensed out of very small needles, fill small cracks and voids
  • Low VOC content
  • Minimal shrinkage



功能和应用



  • 特点:
  • 快速热固化,提高产量并大限度地减少设备停机时间
  • 银填料
  • 优异的导电率0.002 ohm-cm
  • 工作寿命30分钟,适用于宽温度范围,良好的耐化学性,> 1200 psi的搭接剪切,适用于长久粘接表面
  • 多种包装选择
  • 无需称量,在同一包装中混合和分配,大限度地减少工艺废料
  • 薄膏
  • 可以用非常小的针头分配,填充小裂缝和空隙
  • 低VOC含量
  • 收缩率小




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