产品名称：Cho-Bond® Two-Part Conductive Adhesive Cho-Bond®双组分导电胶

PRODUCT DETAILS

Trade Name :  Cho-Bond®

Item Name :  Conductive Adhesive

Short Desc :  50-01-0360-0020 CHOBOND 1 LB KIT

UNSPSC :  31201600

This thick paste is good for filling rather large bond lines and cracks (0.004 - 0.025 Inch) of electrical boxes and enclosures. Curing of Cho-Bond 360-20 can be achieved in as little as 15 min with heat to minimize equipment downtime and increase manufacturing throughput. The 1:1 weight mix ratio makes Cho-Bond 360-20 easy to handle and use.

产品详情

商品名：Cho-Bond®

商品名称：导电胶

简短说明：50-01-0360-0020 CHOBOND 1 LB KIT

UNSPSC：31201600

这种厚浆料适用于填充相当大的粘合线和电气盒和外壳的裂缝（0.004 - 0.025英寸）。Cho-Bond 360-20的固化可在短短15分钟内通过加热实现，从而大限度地减少设备停机时间并提高生产量。1：1的重量混合比使Cho-Bond 360-20易于操作和使用。

SPECS

眼镜

FEATURES & APPLICATIONS

Features :

• Fast heat cure, increases throughput and minimizes equipment downtime
• Silver-plated copper filler
• Low cost, good conductivity 0.005 ohm-cm
• 60 min working life, works well over wide temperature range, good chemical resistance >1600 psi lap shear, good for permanently bonding surfaces
• Gritty paste
• Thick paste, good for relatively large cracks and voids (> 0.25 Inch)
• No VOCs
• Minimal shrinkage, no permits or ventilation required
• Can be used on overhead or vertical surfaces

功能和应用

特点：

• 快速热固化，提高产量并大限度地减少设备停机时间
• 镀银铜填料
• 成本低，导电性好0.005 ohm-cm
• 60分钟的使用寿命，在宽温度范围内工作良好，良好的耐化学性> 1600 psi搭接剪切，适用于长久粘接表面
• 坚韧不拔的糊状物
• 厚浆，适用于较大的裂缝和空隙（> 0.25英寸）
• 没有VOC
• 收缩率小，无需许可证或通风
• 可用于头顶或垂直表面