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**组化笔—PAP PEN
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NU-CHEK
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PRODUCT DETAILS
Series : NXG1-SAC305-88.5
Item Name : Lead-Free Solder Paste
UNSPSC : 23271816
NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.
产品详情
系列:NXG1-SAC305-88.5
商品名称:无铅焊膏
UNSPSC:23271816
NXG1还在回流焊点中提供外观,具有光滑,有光泽的焊料和浅色残留物。该浆料还具有8个月内同类产品中长的保质期。NXG1符合ANSI / J-SDTD-005标准。根据IPC ANSI / J-STD-004B的通量被分类为ROL1。
SPECS
Form | Paste |
Applicable Materials | Stainless Steel, Molybdenum, Nickel Plated or Brass |
Color | Silver Gray |
Flux Type | No-Clean |
Particle Type | Type 3 |
Shelf Life | 8 Months |
Type | Lead-Free |
Storage Temperature | 0 to 10 deg C |
Melting Range | 217 deg C |
Temperature Rating | 21 deg C |
Flux Formula | NXG1 |
Mesh Size | -325/+500 |
RoHS Info | 2011/65/EU Directive |
Flux Designator | ROL1 |
Alloy | Sn96.5 Ag3.0 Cu0.5 (SAC305) |
Odor/Scent | Mild |
眼镜
形成 | 糊 |
适用材料 | 不锈钢,钼,镀镍或黄铜 |
颜色 | 银灰 |
助焊剂类型 | 免洗 |
粒子类型 | 输入3 |
保质期 | 8个月 |
类型 | 无铅 |
贮存温度 | 0到10摄氏度 |
熔化范围 | 217摄氏度 |
温度等级 | 21摄氏度 |
助焊剂配方 | NXG1 |
网格尺寸 | -325 / + 500 |
RoHS信息 | 2011/65 / EU指令 |
Flux指示器 | ROL1 |
合金 | Sn96.5 Ag3.0 Cu0.5(SAC305) |
气味/香味 | 温和 |
FEATURES & APPLICATIONS
Features :
- Capable of 120 min break times in printing
- Capable of print speeds up to 200 mm/sec (8 Inch/sec)
- Clean cosmetic aesthetics after reflow
- Excellent printing characteristics on 0.4 mm (16 Mil) pitch QFPs
- Excellent release from stencil
- Excellent wetting to a variety of metals
- Long stencil and tack life (process dependent)
- Longest shelf life at 8 months
- Low voiding behavior
- Reflowable in air and nitrogen
- Resistant to slump
- Contains halogen
- Metals percentage of 88.5%
- Melting range of 217 to 218 deg C
- Temperature rating of 21 to 25 deg C
Applications :
- For Stencil Printing Applications
功能和应用
特点:
- 印刷时间为120分钟
- 打印速度可达200毫米/秒(8英寸/秒)
- 回流后清洁化妆品美观
- 0.4毫米(16密耳)间距QFP具有印刷特性
- 模板的释放
- 对各种金属具有润湿性
- 长模板和粘性寿命(取决于工艺)
- 长保质期为8个月
- 低排尿行为
- 可在空气和氮气中回流
- 抵抗衰退
- 含有卤素
- 金属百分比为88.5%
- 熔化范围为217至218摄氏度
- 温度等级为21至25摄氏度
应用:
- 用于模板印刷应用